Issued Patents All Time
Showing 376–400 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354988 | Using metal-containing layer to reduce carrier shock in package formation | Hsien-Wen Liu, Yi-Jou Lin | 2019-07-16 |
| 10347612 | Solution for reducing poor contact in InFO package | Jing-Cheng Lin, Chen-Hua Yu, Szu-Wei Lu, Shih-Ting Lin | 2019-07-09 |
| 10347574 | Integrated fan-out packages | Dai-Jang Chen, Hsiang-Tai Lu, Hsien-Wen Liu, Chih-Hsien Lin, Shih-Ting Hung +1 more | 2019-07-09 |
| 10332823 | Packaged semiconductor devices | Kim Hong Chen, Szu-Po Huang, Wensen Hung | 2019-06-25 |
| 10290605 | Fan-out package structure and method for forming the same | Hsien-Wen Liu, Po-Yao Chuang, Tzu-Jui Fang, Yi-Jou Lin | 2019-05-14 |
| 10290590 | Stacked semiconductor device and method of manufacturing the same | Tzu-Jui Fang, Hsi-Kuei Cheng, Chih-Kang Han, Yi-Jen Lai, Hsien-Wen Liu +1 more | 2019-05-14 |
| 10283428 | Semiconductor package and method manufacturing the same | Feng-Cheng Hsu | 2019-05-07 |
| 10283474 | Chip package structure and method for forming the same | Shuo-Mao Chen, Feng-Cheng Hsu | 2019-05-07 |
| 10276551 | Semiconductor device package and method of forming semiconductor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shu-Shen Yeh +1 more | 2019-04-30 |
| 10269584 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou | 2019-04-23 |
| 10269602 | Wafer warpage inspection system and method using the same | Wen-Yi Lin, Po-Yao Lin | 2019-04-23 |
| 10269682 | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Cheng-Chieh Hsieh, Chi-Hsi Wu, Tsung-Yu Chen, Wensen Hung | 2019-04-23 |
| 10269723 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Chen-Hua Yu | 2019-04-23 |
| 10269730 | Methods of manufacturing an integrated circuit having stress tuning layer | Clinton Chao, Szu-Wei Lu | 2019-04-23 |
| 10269752 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Li-Hsien Huang, Hsien-Wei Chen +2 more | 2019-04-23 |
| 10262939 | Configurable routing for packaging applications | Chung-Yu Lu, Hsien-Pin Hu, Shang-Yun Hou, Tzuan-Horng Liu, Shih-Wen Huang +1 more | 2019-04-16 |
| 10175294 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Chen-Hua Yu, Chao-Hsiang Yang | 2019-01-08 |
| 10170396 | Through via structure extending to metallization layer | Yi-Hsiu Chen, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2019-01-01 |
| 10163705 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2018-12-25 |
| 10163816 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu | 2018-12-25 |
| 10163822 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2018-12-25 |
| 10163860 | Semiconductor package structure | Feng-Cheng Hsu, Shuo-Mao Chen, Jui-Pin Hung | 2018-12-25 |
| 10163861 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2018-12-25 |
| 10163876 | Semiconductor structure and manufacturing method thereof | Jui-Pin Hung, Feng-Cheng Hsu | 2018-12-25 |
| 10163706 | Alignment marks in substrate having through-substrate via (TSV) | Hsin Chang, Fang Wen Tsai, Jing-Cheng Lin, Wen-Chih Chiou | 2018-12-25 |