Issued Patents All Time
Showing 1–25 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334489 | Lthc as charging barrier in info package formation | Yi-Jen Lai, Chung-Yi Lin, Chen-Shien Chen, Kuo-Chio Liu | 2025-06-17 |
| 12261074 | Info structure with copper pillar having reversed profile | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2025-03-25 |
| 12051634 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more | 2024-07-30 |
| 12046588 | Package on package structure | Dong Shen, Chen-Shien Chen, Kuo-Chio Liu, Yi-Jen Lai | 2024-07-23 |
| 11990454 | Package structure and method of forming the same | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2024-05-21 |
| 11984342 | Info structure with copper pillar having reversed profile | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2024-05-14 |
| 11948881 | Semiconductor structure | Chih-Kang Han, Ching Fu Chang, Hsin-Chieh Huang | 2024-04-02 |
| 11923353 | LTHC as charging barrier in info package formation | Yi-Jen Lai, Chung-Yi Lin, Chen-Shien Chen, Kuo-Chio Liu | 2024-03-05 |
| 11756849 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more | 2023-09-12 |
| 11437361 | LTHC as charging barrier in InFO package formation | Yi-Jen Lai, Lin Chung-Yi, Chen-Shien Chen, Kuo-Chio Liu | 2022-09-06 |
| 11404341 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more | 2022-08-02 |
| 11257797 | Package on package structure | Dong Shen, Chen-Shien Chen, Kuo-Chio Liu, Yi-Jen Lai | 2022-02-22 |
| 11217548 | Semiconductor device structure and manufacturing method | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen | 2022-01-04 |
| 11145613 | Method for forming bump structure | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen | 2021-10-12 |
| 11069614 | Semiconductor package structure | Chih-Kang Han, Ching Fu Chang, Hsin-Chieh Huang | 2021-07-20 |
| 10950478 | Info structure with copper pillar having reversed profile | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2021-03-16 |
| 10867973 | Package structure and method of forming the same | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2020-12-15 |
| 10692809 | Manufacturing method for semiconductor structure | Chih-Kang Han, Ching Fu Chang, Hsin-Chieh Huang | 2020-06-23 |
| 10573573 | Package and package-on-package structure having elliptical conductive columns | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more | 2020-02-25 |
| 10546845 | Package on package structure | Dong Shen, Chen-Shien Chen, Kuo-Chio Liu, Yi-Jen Lai | 2020-01-28 |
| 10529697 | Package structure and method of forming the same | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2020-01-07 |
| 10522526 | LTHC as charging barrier in InFO package formation | Yi-Jen Lai, Lin Chung-Yi, Chen-Shien Chen, Kuo-Chio Liu | 2019-12-31 |
| 10290590 | Stacked semiconductor device and method of manufacturing the same | Shin-Puu Jeng, Tzu-Jui Fang, Chih-Kang Han, Yi-Jen Lai, Hsien-Wen Liu +1 more | 2019-05-14 |
| 10290530 | Info structure with copper pillar having reversed profile | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2019-05-14 |
| 10163843 | Semiconductor device structure and manufacturing method | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen | 2018-12-25 |