Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334489 | Lthc as charging barrier in info package formation | Yi-Jen Lai, Chung-Yi Lin, Hsi-Kuei Cheng, Chen-Shien Chen | 2025-06-17 |
| 12183709 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li +2 more | 2024-12-31 |
| 12087618 | Method for forming semiconductor die having edge with multiple gradients | Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Wen-Ming Chen, Chun-Yen Lo | 2024-09-10 |
| 12051634 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2024-07-30 |
| 12046588 | Package on package structure | Dong Shen, Chen-Shien Chen, Hsi-Kuei Cheng, Yi-Jen Lai | 2024-07-23 |
| 11984419 | Package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2024-05-14 |
| 11923353 | LTHC as charging barrier in info package formation | Yi-Jen Lai, Chung-Yi Lin, Hsi-Kuei Cheng, Chen-Shien Chen | 2024-03-05 |
| 11848302 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li +2 more | 2023-12-19 |
| 11756849 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2023-09-12 |
| 11594484 | Forming bonding structures by using template layer as templates | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky +3 more | 2023-02-28 |
| 11545463 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li +2 more | 2023-01-03 |
| 11469203 | Method for forming package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2022-10-11 |
| 11437361 | LTHC as charging barrier in InFO package formation | Yi-Jen Lai, Lin Chung-Yi, Hsi-Kuei Cheng, Chen-Shien Chen | 2022-09-06 |
| 11404341 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2022-08-02 |
| 11257797 | Package on package structure | Dong Shen, Chen-Shien Chen, Hsi-Kuei Cheng, Yi-Jen Lai | 2022-02-22 |
| 11211318 | Bump layout for coplanarity improvement | Ling Li, Cheng-Lin Huang, Min-Tar Liu, Fu-Kang Chiao, Matt Chou +3 more | 2021-12-28 |
| 11088108 | Chip package structure including ring-like structure and method for forming the same | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li +2 more | 2021-08-10 |
| 11069652 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2021-07-20 |
| 11004728 | Semiconductor die having edge with multiple gradients and method for forming the same | Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Wen-Ming Chen, Chun-Yen Lo | 2021-05-11 |
| 10811377 | Package structure with a barrier layer and method for forming the same | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2020-10-20 |
| 10700001 | Forming bonding structures by using template layer as templates | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky +3 more | 2020-06-30 |
| 10573573 | Package and package-on-package structure having elliptical conductive columns | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2020-02-25 |
| 10546845 | Package on package structure | Dong Shen, Chen-Shien Chen, Hsi-Kuei Cheng, Yi-Jen Lai | 2020-01-28 |
| 10535629 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2020-01-14 |
| 10535554 | Semiconductor die having edge with multiple gradients and method for forming the same | Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Chun-Yen Lo, Wen-Ming Chen | 2020-01-14 |