Issued Patents All Time
Showing 1–25 of 350 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431400 | Packages with enlarged through-vias in encapsulant | Tai-Min Chang, Hui-Jung Tsai, De-Yuan Lu, Ming-Tan Lee | 2025-09-30 |
| 12416862 | Apparatus, system and method | Po-Han Wang, Yu-Hsiang Hu, Chen-Hua Yu | 2025-09-16 |
| 12412867 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu | 2025-09-09 |
| 12412856 | Package structure and method of manufacturing the same | Ting-Chen Tseng, Yu-Hsiang Hu, Sih-Hao Liao | 2025-09-09 |
| 12400876 | Methods of manufacture having redistribution layer using dielectric material photoactive component | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao | 2025-08-26 |
| 12394741 | Integrated circuit packages having adhesion layers for through vias | Hung-Chun Cho, Sih-Hao Liao, Yu-Hsiang Hu | 2025-08-19 |
| 12381176 | Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei +1 more | 2025-08-05 |
| 12381186 | Redistribution structure for semiconductor device and method of forming same | Po-Han Wang, Yu-Hsiang Hu | 2025-08-05 |
| 12374592 | Semiconductor device and manufacturing method thereof | Cheng-Chieh Wu, Ting Hao Kuo, Kuo Lung Pan, Po-Yuan Teng, Yu-Chia Lai +7 more | 2025-07-29 |
| 12362309 | Package structure | Hui-Jung Tsai, Jyun-Siang Peng | 2025-07-15 |
| 12353134 | Photoresist system and method | De-Yuan Lu, Chen-Hua Yu, Ming-Tan Lee | 2025-07-08 |
| 12347801 | Semiconductor package and method for manufacturing the same | Po-Han Wang, Shih-Peng Tai, Yu-Hsiang Hu, I-Chia Chen | 2025-07-01 |
| 12347791 | Integrated circuit package and method | Chen-Hua Yu, Tzu-Yun Huang, Ming-Che Ho | 2025-07-01 |
| 12341072 | Manufacturing method of semiconductor package | Shih-Hao Tseng, Ming-Che Ho | 2025-06-24 |
| 12334433 | Semiconductor device and method of fabricating the same | Sih-Hao Liao, Yu-Hsiang Hu | 2025-06-17 |
| 12322688 | Package structure including auxiliary dielectric portion | Po-Han Wang, Sih-Hao Liao, Wei-Chih Chen, Hung-Chun Cho, Ting-Chen Tseng +1 more | 2025-06-03 |
| 12322682 | Semiconductor package having composite seed-barrier layer and method of forming the same | Wei-Chung Chang, Ming-Che Ho | 2025-06-03 |
| 12315772 | Package and manufacturing method thereof | Yung-Chi Chu, Yu-Hsiang Hu, Sih-Hao Liao | 2025-05-27 |
| 12315819 | Method of forming RDLs and structure formed thereof | Yun Chen Hsieh, Chen-Hua Yu, Hui-Jung Tsai | 2025-05-27 |
| 12298667 | Lithography | Meng-Che Tu, Po-Han Wang, Sih-Hao Liao, Yu-Hsiang Hu | 2025-05-13 |
| 12302677 | Semiconductor device and method | Chen-Hua Yu, Keng-Han Lin, Hui-Jung Tsai | 2025-05-13 |
| 12300598 | Package structure and method of fabricating the same | Yi-Wen Wu, Ming-Che Ho | 2025-05-13 |
| 12293988 | Semiconductor package and method of forming the same | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao, Hung-Chun Cho | 2025-05-06 |
| 12283545 | Package structure and method of manufacturing the same | Yung-Chi Chu, Yu-Hsiang Hu, Wei-Chih Chen | 2025-04-22 |
| 12265330 | Polymer material in a redistribution structure of a semiconductor package and method of manufacture | Sih-Hao Liao, Yu-Hsiang Hu, Chen-Hua Yu | 2025-04-01 |