Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12416862 | Apparatus, system and method | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2025-09-16 |
| 12381186 | Redistribution structure for semiconductor device and method of forming same | Yu-Hsiang Hu, Hung-Jui Kuo | 2025-08-05 |
| 12374592 | Semiconductor device and manufacturing method thereof | Cheng-Chieh Wu, Ting Hao Kuo, Kuo Lung Pan, Po-Yuan Teng, Yu-Chia Lai +7 more | 2025-07-29 |
| 12349068 | Low power Wi-Fi backscatter communication | Patrick Mercier, Dinesh Bharadia | 2025-07-01 |
| 12347801 | Semiconductor package and method for manufacturing the same | Hung-Jui Kuo, Shih-Peng Tai, Yu-Hsiang Hu, I-Chia Chen | 2025-07-01 |
| 12322688 | Package structure including auxiliary dielectric portion | Sih-Hao Liao, Wei-Chih Chen, Hung-Chun Cho, Ting-Chen Tseng, Yu-Hsiang Hu +1 more | 2025-06-03 |
| 12298667 | Lithography | Meng-Che Tu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-05-13 |
| 12242197 | Apparatus, system and method | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2025-03-04 |
| 12170223 | Method of fabricating redistribution circuit structure | Yu-Hsiang Hu, Hung-Jui Kuo | 2024-12-17 |
| 12094765 | Integrated circuit package and method | Ting-Chen Tseng, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-09-17 |
| 12051659 | Semiconductor devices having conductive pad structures with multi-barrier films | Po-Hsun Huang, Ing-Ju Lee, Chao-Lung Chen, Cheng-Ming Wu | 2024-07-30 |
| 11973023 | Stacked via structure | Hung-Jui Kuo, Yu-Hsiang Hu | 2024-04-30 |
| 11948918 | Redistribution structure for semiconductor device and method of forming same | Yu-Hsiang Hu, Hung-Jui Kuo | 2024-04-02 |
| 11942417 | Sensor package and method | Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-03-26 |
| 11942435 | Semiconductor package and method | Hung-Jui Kuo, Yu-Hsiang Hu | 2024-03-26 |
| 11892774 | Lithography | Meng-Che Tu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-02-06 |
| 11842902 | Semiconductor package with alignment mark and manufacturing method thereof | Hung-Jui Kuo, Yu-Hsiang Hu | 2023-12-12 |
| 11817352 | Method of fabricating redistribution circuit structure | Yu-Hsiang Hu, Hung-Jui Kuo | 2023-11-14 |
| 11688703 | Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films | Po-Hsun Huang, Ing-Ju Lee, Chao-Lung Chen, Cheng-Ming Wu | 2023-06-27 |
| 11682636 | Info structure and method forming same | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2023-06-20 |
| 11682647 | Semiconductor package and method for manufacturing the same | Hung-Jui Kuo, Shih-Peng Tai, Yu-Hsiang Hu, I-Chia Chen | 2023-06-20 |
| 11664323 | Semiconductor package and method | Hung-Jui Kuo, Yu-Hsiang Hu | 2023-05-30 |
| 11570709 | BLE and/or WiFi compliant and blocker-resilient wake-up receiver and method | Patrick Mercier | 2023-01-31 |
| 11532531 | Semiconductor package | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2022-12-20 |
| 11532540 | Planarizing RDLS in RDL-first processes through CMP process | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2022-12-20 |