Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412856 | Package structure and method of manufacturing the same | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2025-09-09 |
| 12322688 | Package structure including auxiliary dielectric portion | Po-Han Wang, Sih-Hao Liao, Wei-Chih Chen, Hung-Chun Cho, Yu-Hsiang Hu +1 more | 2025-06-03 |
| 12094765 | Integrated circuit package and method | Sih-Hao Liao, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-09-17 |
| 12009226 | Semiconductor device and method of forming same | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-06-11 |
| 11862594 | Package structure with solder resist underlayer for warpage control and method of manufacturing the same | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2024-01-02 |
| 11854927 | Semiconductor package and method of forming same | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-12-26 |
| 11227795 | Integrated circuit package and method | Sih-Hao Liao, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2022-01-18 |