Issued Patents All Time
Showing 1–25 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412867 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Yung-Chi Chu | 2025-09-09 |
| 12412856 | Package structure and method of manufacturing the same | Ting-Chen Tseng, Hung-Jui Kuo, Yu-Hsiang Hu | 2025-09-09 |
| 12400876 | Methods of manufacture having redistribution layer using dielectric material photoactive component | Wei-Chih Chen, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-08-26 |
| 12394741 | Integrated circuit packages having adhesion layers for through vias | Hung-Chun Cho, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-08-19 |
| 12334433 | Semiconductor device and method of fabricating the same | Hung-Jui Kuo, Yu-Hsiang Hu | 2025-06-17 |
| 12322688 | Package structure including auxiliary dielectric portion | Po-Han Wang, Wei-Chih Chen, Hung-Chun Cho, Ting-Chen Tseng, Yu-Hsiang Hu +1 more | 2025-06-03 |
| 12315772 | Package and manufacturing method thereof | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu | 2025-05-27 |
| 12298667 | Lithography | Meng-Che Tu, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-05-13 |
| 12293988 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Hung-Chun Cho | 2025-05-06 |
| 12265330 | Polymer material in a redistribution structure of a semiconductor package and method of manufacture | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2025-04-01 |
| 12249588 | Semiconductor device and methods of manufacture | Hung-Chun Cho, Hung-Jui Kuo, Yu-Hsiang Hu | 2025-03-11 |
| 12218009 | Semiconductor package and methods of forming the same | Meng-Che Tu, Wei-Chih Chen, Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2025-02-04 |
| 12211802 | Package structure and method of fabricating the same | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Yung-Chi Chu | 2025-01-28 |
| 12191222 | Integrated fan out device with a filler-free insulating material | Wei-Chih Chen, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-01-07 |
| 12165966 | Package and method of manufacturing the same | Meng-Che Tu, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-12-10 |
| 12147159 | Semiconductor device and method of manufacture | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2024-11-19 |
| 12119235 | Methods of manufacture of semiconductor devices having redistribution layer using dielectric material having photoactive component | Wei-Chih Chen, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-10-15 |
| 12094765 | Integrated circuit package and method | Ting-Chen Tseng, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-09-17 |
| 12094728 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Chen-Cheng Kuo, Hung-Jui Kuo +3 more | 2024-09-17 |
| 12087654 | Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu, Tian Hu | 2024-09-10 |
| 12068273 | Package | Tian Hu, Hung-Jui Kuo, Yu-Hsiang Hu | 2024-08-20 |
| 12009331 | Integrated circuit packages having adhesion layers for through vias | Hung-Chun Cho, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-06-11 |
| 12009226 | Semiconductor device and method of forming same | Ting-Chen Tseng, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-06-11 |
| 11961777 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo +3 more | 2024-04-16 |
| 11948904 | Die and package structure | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu | 2024-04-02 |