Issued Patents All Time
Showing 26–50 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948904 | Die and package structure | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu | 2024-04-02 |
| 11942417 | Sensor package and method | Yung-Chi Chu, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-03-26 |
| 11892774 | Lithography | Meng-Che Tu, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-02-06 |
| 11894336 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Yung-Chi Chu | 2024-02-06 |
| 11868047 | Polymer layer in semiconductor device and method of manufacture | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2024-01-09 |
| 11862594 | Package structure with solder resist underlayer for warpage control and method of manufacturing the same | Ting-Chen Tseng, Hung-Jui Kuo, Yu-Hsiang Hu | 2024-01-02 |
| 11854997 | Method of forming semiconductor device | Jhih-Yu Wang, Yung-Chi Chu, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-12-26 |
| 11854927 | Semiconductor package and method of forming same | Ting-Chen Tseng, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-12-26 |
| 11837502 | Semiconductor package and methods of forming the same | Meng-Che Tu, Wei-Chih Chen, Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2023-12-05 |
| 11798857 | Composition for sacrificial film, package, manufacturing method of package | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu | 2023-10-24 |
| 11791313 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Hung-Chun Cho | 2023-10-17 |
| 11764124 | Sensing component encapsulated by an encapsulant with a roughness surface having a hollow region | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu, Tian Hu | 2023-09-19 |
| 11728181 | Semiconductor device and method | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2023-08-15 |
| 11721603 | Integrated fan out method utilizing a filler-free insulating material | Wei-Chih Chen, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-08-08 |
| 11715717 | Methods of forming integrated circuit packages having adhesion layers over through vias | Hung-Chun Cho, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-08-01 |
| 11699598 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Chen-Cheng Kuo, Hung-Jui Kuo +3 more | 2023-07-11 |
| 11694967 | Package structure and method of fabricating the same | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Yung-Chi Chu | 2023-07-04 |
| 11605607 | Semiconductor device and methods of manufacture | Hung-Chun Cho, Hung-Jui Kuo, Yu-Hsiang Hu | 2023-03-14 |
| 11600592 | Package | Tian Hu, Hung-Jui Kuo, Yu-Hsiang Hu | 2023-03-07 |
| 11594472 | Package structure and method of forming the same | Hung-Chun Cho, Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen | 2023-02-28 |
| 11532531 | Semiconductor package | Po-Han Wang, Hung-Jui Kuo, Yu-Hsiang Hu | 2022-12-20 |
| 11454888 | Semiconductor device and method of manufacture | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2022-09-27 |
| 11456280 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Hung-Chun Cho | 2022-09-27 |
| 11450603 | Semiconductor device and method of fabricating the same | Hung-Jui Kuo, Yu-Hsiang Hu | 2022-09-20 |
| 11417582 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Hung-Chun Cho | 2022-08-16 |