SL

Sih-Hao Liao

TSMC: 81 patents #362 of 12,232Top 3%
NU National Tsing Hua University: 1 patents #672 of 2,036Top 35%
📍 New Taipei, TW: #62 of 10,472 inventorsTop 1%
Overall (All Time): #21,289 of 4,157,543Top 1%
82
Patents All Time

Issued Patents All Time

Showing 76–82 of 82 patents

Patent #TitleCo-InventorsDate
10446521 Integrated fan-out package and method of fabricating an integrated fan-out package Hung-Jui Kuo, Yu-Hsiang Hu 2019-10-15
10332856 Package structure and method of fabricating the same Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Po-Han Wang 2019-06-25
10276421 Integrated fan-out package, integrated fan-out package array, and method of manufacturing integrated fan-out packages Hung-Jui Kuo, Yu-Hsiang Hu 2019-04-30
10276543 Semicondcutor device package and method of forming semicondcutor device package Hung-Jui Kuo, Yu-Hsiang Hu 2019-04-30
10049889 Method of fabricating package structures Yu-Hsiang Hu, Chung-Shi Liu, Hung-Jui Kou 2018-08-14
9741586 Method of fabricating package structures Yu-Hsiang Hu, Chung-Shi Liu, Hung-Jui Kuo 2017-08-22
9105851 Composite material of hole-blocking polymer and electron-injection/electron-transport conjugated polymer grafted with crown ether into which metal ion is intercalated, and uses thereof in OLED and organic solar cell Show-An Chen, Hsin-Hung Lu, Yun Wu, Yun Ma 2015-08-11