Issued Patents All Time
Showing 1–25 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431446 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2025-09-30 |
| 12418001 | 3D integrated circuit (3DIC) structure | Chen-Hua Yu, Wen-Chih Chiou | 2025-09-16 |
| 12412817 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2025-09-09 |
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Chien-Hsun Chen, Tuan-Yu Hung, Hsin-Yu Pan, Wei-Kang Hsieh +8 more | 2025-09-02 |
| 12406961 | Integrated circuit package and method | Mao-Yen Chang, Yu-Chia Lai, Kuo Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh +4 more | 2025-09-02 |
| 12400936 | Stacked memory cube with integrated thermal path for enhanced heat dissipation | Lipu Kris Chuang, Han-Ping Pu, Hsin-Yu Pan, Ming-Kai Liu, Ting-Chu Ko | 2025-08-26 |
| 12394732 | Semiconductor package and method | Jiun Yi Wu, Chen-Hua Yu | 2025-08-19 |
| 12394242 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2025-08-19 |
| 12394736 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chen-Hua Yu | 2025-08-19 |
| 12381163 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai +3 more | 2025-08-05 |
| 12368149 | Methods of forming semiconductor packages | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2025-07-22 |
| 12368141 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu | 2025-07-22 |
| 12362228 | Semiconductor package and method | Chen-Hua Yu, Wei-Yu Chen, Jiun Yi Wu, Chien-Hsun Lee | 2025-07-15 |
| 12358194 | Molded semiconductor device and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2025-07-15 |
| 12356558 | Electronic assembly having circuit carrier | Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2025-07-08 |
| 12354924 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee | 2025-07-08 |
| 12354969 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu, Chien-Hsun Lee | 2025-07-08 |
| 12345740 | Probe card substrate, substrate structure and method of fabricating the same | Wei-Yu Chen, Yu-Min Liang, Hao-Cheng Hou, Tsung-Ding Wang, Chien-Hsun Lee +1 more | 2025-07-01 |
| 12334446 | Semiconductor package and method | Jiun Yi Wu, Chen-Hua Yu | 2025-06-17 |
| 12300659 | Aligning bumps in fan-out packaging process | Ying-Jui Huang, Chien Ling Hwang, Chih-Wei Lin, Ching-Hua Hsieh, Chen-Hua Yu | 2025-05-13 |
| 12300652 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen | 2025-05-13 |
| 12288729 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2025-04-29 |
| 12266619 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Shou-Zen Chang, Chao-Wen Shih | 2025-04-01 |
| 12266673 | Semiconductor package and method of forming the same | Chia-Lun Chang, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Hsiu-Jen Lin | 2025-04-01 |
| 12260669 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang | 2025-03-25 |