Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12358194 | Molded semiconductor device and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Yao-Tong Lai +1 more | 2025-07-15 |
| 12354997 | Package structure and manufacturing method thereof | Chia-Min Lin, Tzu-Ting Chou, Sheng-Feng Weng, Chao-Wei Li, Chih-Wei Lin +1 more | 2025-07-08 |
| 12230549 | Three-dimensional integrated circuit structures and methods of forming the same | Chia-Min Lin, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Feng Weng, Yao-Tong Lai | 2025-02-18 |
| 12218082 | Package structure | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai +4 more | 2025-02-04 |
| 12057415 | Semiconductor device having antenna and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Meng-Tse Chen | 2024-08-06 |
| 12011859 | Molding apparatus and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Yao-Tong Lai +1 more | 2024-06-18 |
| 11955460 | Advanced info POP and method of forming thereof | Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Wei-Hung Lin, Ming-Da Cheng +2 more | 2024-04-09 |
| 11855006 | Memory device, package structure and fabricating method thereof | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai +4 more | 2023-12-26 |
| 11785723 | Lens module | Ching-Hui Chang | 2023-10-10 |
| 11731327 | Molding apparatus and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Yao-Tong Lai +1 more | 2023-08-22 |
| 11705409 | Semiconductor device having antenna on chip package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Meng-Tse Chen | 2023-07-18 |
| 11446851 | Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Yao-Tong Lai +1 more | 2022-09-20 |
| 11309226 | Three-dimensional integrated circuit structures and methods of forming the same | Chia-Min Lin, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Feng Weng, Yao-Tong Lai | 2022-04-19 |
| 10797025 | Advanced INFO POP and method of forming thereof | Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Wei-Hung Lin, Ming-Da Cheng +2 more | 2020-10-06 |
| 10757310 | Miniature image pickup module and manufacturing method thereof | Ching-Hui Chang, Yi-Hou Chen | 2020-08-25 |
| 10741508 | Semiconductor device having antenna and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Meng-Tse Chen | 2020-08-11 |
| 10325883 | Package-on-package structure and method | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Feng Weng, Ming-Da Cheng | 2019-06-18 |
| 10283470 | Semiconductor package and manufacturing method thereof | Chih-Wei Lin, Shing-Chao Chen, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu +2 more | 2019-05-07 |
| 10283377 | Integrated fan-out package and manufacturing method thereof | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Yao-Tong Lai | 2019-05-07 |
| 10163754 | Lid design for heat dissipation enhancement of die package | Kuan-Lin Ho, Hsin-Yu Pan, Yu-Chih Liu, Chin-Liang Chen | 2018-12-25 |
| 9859229 | Package structure and method for forming the same | Yu-Peng Tsai, Sheng-Feng Weng, Meng-Tse Chen, Chih-Wei Lin, Wei-Hung Lin +3 more | 2018-01-02 |
| 9818729 | Package-on-package structure and method | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Feng Weng, Ming-Da Cheng | 2017-11-14 |
| 8048778 | Methods of dicing a semiconductor structure | Chin-Yu Ku, Hsiu-Mei Yu, Chun-Ying Lin, Young-Chang Lien, Ta-Jen Yu | 2011-11-01 |