Issued Patents All Time
Showing 1–25 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424571 | Package structure and manufacturing method thereof | Sen-Kuei Hsu | 2025-09-23 |
| 12418005 | Semiconductor package and manufacturing method thereof | Tzuan-Horng Liu, Hao-Yi Tsai, Kris Lipu Chuang | 2025-09-16 |
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Chien-Hsun Chen, Tuan-Yu Hung, Wei-Kang Hsieh, Tsung-Hsien Chiang +8 more | 2025-09-02 |
| 12400936 | Stacked memory cube with integrated thermal path for enhanced heat dissipation | Lipu Kris Chuang, Chung-Shi Liu, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko | 2025-08-26 |
| 12388041 | Semiconductor package | Kris Lipu Chuang, Hsiu-Jen Lin, Tzu-Sung Huang | 2025-08-12 |
| 12362270 | Package structure and method of fabricating the same | Kris Lipu Chuang, Tzu-Sung Huang, Chih-Wei Lin, Yu-Fu Chen, Hao-Yi Tsai | 2025-07-15 |
| 12362321 | Semiconductor package | Tsung-Ding Wang, Yen-Fu Su, Hao-Cheng Hou, Jung Wei Cheng, Chien-Hsun Lee | 2025-07-15 |
| 12362275 | Method of fabricating package structure including a plurality of antenna patterns | Sen-Kuei Hsu, Yi-Che Chiang | 2025-07-15 |
| 12279064 | Image compensation circuit for gamma calibration | Wei-Jhe Ma, Feng-Ting Pai, Jun Yang | 2025-04-15 |
| 12266648 | Package structure | Sen-Kuei Hsu, Ming-Hsien Tsai | 2025-04-01 |
| 12255196 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Chih-Hua Chen, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2025-03-18 |
| 12230589 | Semiconductor package | Chi-Yang Yu, Jung Wei Cheng, Yu-Min Liang, Jiun Yi Wu, Yen-Fu Su +1 more | 2025-02-18 |
| 12218021 | Semiconductor packages and methods of forming the same | Jung Wei Cheng, Jiun Yi Wu, Tsung-Ding Wang, Yu-Min Liang, Wei-Yu Chen | 2025-02-04 |
| 12021024 | Semiconductor device including a semiconductor die and a plurality of antenna patterns | Sen-Kuei Hsu, Yi-Che Chiang | 2024-06-25 |
| 12014992 | Semiconductor package | Sen-Kuei Hsu, Chien-Chang Lin | 2024-06-18 |
| 11984372 | Integrated circuit package and method | Teng-Yuan Lo, Lipu Kris Chuang | 2024-05-14 |
| 11942442 | Package structure and manufacturing method thereof | Sen-Kuei Hsu | 2024-03-26 |
| 11894299 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hao-Yi Tsai, Sen-Kuei Hsu | 2024-02-06 |
| 11894341 | Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof | Tsung-Ding Wang, Yen-Fu Su, Hao-Cheng Hou, Jung Wei Cheng, Chien-Hsun Lee | 2024-02-06 |
| 11830866 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Chih-Hua Chen, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2023-11-28 |
| 11824054 | Package structure | Sen-Kuei Hsu, Ming-Hsien Tsai | 2023-11-21 |
| 11749640 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2023-09-05 |
| 11705408 | Semiconductor package | Chi-Yang Yu, Jung Wei Cheng, Yu-Min Liang, Jiun Yi Wu, Yen-Fu Su +1 more | 2023-07-18 |
| 11705378 | Semiconductor packages and methods of forming the same | Jung Wei Cheng, Jiun Yi Wu, Tsung-Ding Wang, Yu-Min Liang, Wei-Yu Chen | 2023-07-18 |
| 11574857 | Semiconductor package and manufacturing method thereof | Ching-Feng Yang, Kai-Chiang Wu, Chien-Chang Lin | 2023-02-07 |