Issued Patents All Time
Showing 1–25 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418982 | Laminated structure with pads and manufacturing method thereof | Hao-Cheng Hou, Tsung-Ding Wang, Chien-Hsun Chen, Chien-Hsun Lee | 2025-09-16 |
| 12417968 | Package structure and forming method thereof | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang, Hao-Cheng Hou, Tsung-Ding Wang | 2025-09-16 |
| 12412846 | Semiconductor package and methods of fabricating a semiconductor package | Chin-Liang Chen, Hao-Cheng Hou, Yu-Min Liang, Tsung-Ding Wang | 2025-09-09 |
| 12368112 | Electronic component and manufacturing method thereof | Chi-Yang Yu, Yu-Min Liang, Chien-Hsun Lee | 2025-07-22 |
| 12362321 | Semiconductor package | Tsung-Ding Wang, Yen-Fu Su, Hao-Cheng Hou, Chien-Hsun Lee, Hsin-Yu Pan | 2025-07-15 |
| 12345740 | Probe card substrate, substrate structure and method of fabricating the same | Wei-Yu Chen, Yu-Min Liang, Hao-Cheng Hou, Tsung-Ding Wang, Chien-Hsun Lee +1 more | 2025-07-01 |
| 12249587 | Semiconductor structure and forming method thereof | Jiun Yi Wu, Chen-Hua Yu, Yu-Min Liang | 2025-03-11 |
| 12230589 | Semiconductor package | Chi-Yang Yu, Yu-Min Liang, Jiun Yi Wu, Yen-Fu Su, Chien-Chang Lin +1 more | 2025-02-18 |
| 12218021 | Semiconductor packages and methods of forming the same | Jiun Yi Wu, Hsin-Yu Pan, Tsung-Ding Wang, Yu-Min Liang, Wei-Yu Chen | 2025-02-04 |
| 12142560 | Semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin +3 more | 2024-11-12 |
| 11961777 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo +3 more | 2024-04-16 |
| 11894341 | Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof | Tsung-Ding Wang, Yen-Fu Su, Hao-Cheng Hou, Chien-Hsun Lee, Hsin-Yu Pan | 2024-02-06 |
| 11705378 | Semiconductor packages and methods of forming the same | Jiun Yi Wu, Hsin-Yu Pan, Tsung-Ding Wang, Yu-Min Liang, Wei-Yu Chen | 2023-07-18 |
| 11705408 | Semiconductor package | Chi-Yang Yu, Yu-Min Liang, Jiun Yi Wu, Yen-Fu Su, Chien-Chang Lin +1 more | 2023-07-18 |
| 11538761 | Semiconductor package having molded die and semiconductor die and manufacturing method thereof | Hao-Cheng Hou, Wei-Yu Chen, Tsung-Ding Wang, Chien-Hsun Lee, Chung-Shi Liu | 2022-12-27 |
| 11424199 | Connector formation methods and packaged semiconductor devices | Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2022-08-23 |
| 11404342 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo +3 more | 2022-08-02 |
| 11387118 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Chi-Yang Yu, Chin-Liang Chen | 2022-07-12 |
| 11270921 | Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof | Hao-Cheng Hou, Chien-Hsun Lee, Chung-Shi Liu, Tsung-Ding Wang, Yi-Yang Lei | 2022-03-08 |
| 11244879 | Semiconductor package | Chi-Yang Yu, Chien-Hsun Lee, Tsung-Ding Wang, Yu-Min Liang | 2022-02-08 |
| 11158614 | Thermal performance structure for semiconductor packages and method of forming same | Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee | 2021-10-26 |
| 11145639 | Semiconductor package and manufacturing method thereof | Chien-Hsun Lee, Chi-Yang Yu, Hao-Cheng Hou, Hsin-Yu Pan, Tsung-Ding Wang | 2021-10-12 |
| 11139281 | Molded underfilling for package on package devices | Chen-Hua Yu, Chien-Hsun Lee, Tsung-Ding Wang, Ming-Da Cheng, Yung Ching Chen | 2021-10-05 |
| 11127644 | Planarization of semiconductor packages and structures resulting therefrom | Chi-Yang Yu, Hai-Ming Chen, Yu-Min Liang, Chien-Hsun Lee | 2021-09-21 |
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin +3 more | 2021-08-24 |