Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362321 | Semiconductor package | Tsung-Ding Wang, Hao-Cheng Hou, Jung Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan | 2025-07-15 |
| 12230589 | Semiconductor package | Chi-Yang Yu, Jung Wei Cheng, Yu-Min Liang, Jiun Yi Wu, Chien-Chang Lin +1 more | 2025-02-18 |
| 11894341 | Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof | Tsung-Ding Wang, Hao-Cheng Hou, Jung Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan | 2024-02-06 |
| 11705408 | Semiconductor package | Chi-Yang Yu, Jung Wei Cheng, Yu-Min Liang, Jiun Yi Wu, Chien-Chang Lin +1 more | 2023-07-18 |
| 11004812 | Package structure and method of forming the same | Tuan-Yu Hung, Hung-Jui Kuo, Hsin-Yu Pan, Ming-Che Ho, Tzu-Yun Huang | 2021-05-11 |