Issued Patents All Time
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417968 | Package structure and forming method thereof | Chin-Liang Chen, Yu-Min Liang, Hao-Cheng Hou, Jung Wei Cheng, Tsung-Ding Wang | 2025-09-16 |
| 12412862 | Package structure and manufacturing method thereof | Nien-Fang Wu, Hai-Ming Chen, Yu-Min Liang, Jiun Yi Wu | 2025-09-09 |
| 12368112 | Electronic component and manufacturing method thereof | Jung Wei Cheng, Yu-Min Liang, Chien-Hsun Lee | 2025-07-22 |
| 12347802 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang, Jiun Yi Wu | 2025-07-01 |
| 12230589 | Semiconductor package | Jung Wei Cheng, Yu-Min Liang, Jiun Yi Wu, Yen-Fu Su, Chien-Chang Lin +1 more | 2025-02-18 |
| 12165946 | Semiconductor package and manufacturing method thereof | Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen | 2024-12-10 |
| 12062604 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Jiun Yi Wu, Yu-Min Liang, Wei-Yu Chen | 2024-08-13 |
| 11908835 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang | 2024-02-20 |
| 11855057 | Package structure and method of forming the same | Yu-Min Liang, Jiun Yi Wu, Chien-Hsun Lee | 2023-12-26 |
| 11824032 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang, Jiun Yi Wu | 2023-11-21 |
| 11784106 | Semiconductor package and manufacturing method thereof | Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen | 2023-10-10 |
| 11749594 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Jiun Yi Wu, Yu-Min Liang, Wei-Yu Chen | 2023-09-05 |
| 11705408 | Semiconductor package | Jung Wei Cheng, Yu-Min Liang, Jiun Yi Wu, Yen-Fu Su, Chien-Chang Lin +1 more | 2023-07-18 |
| 11616037 | Integrated fan-out package and manufacturing method thereof | Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang | 2023-03-28 |
| 11508640 | Semiconductor package and manufacturing method thereof | Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen | 2022-11-22 |
| 11424220 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang | 2022-08-23 |
| 11387118 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Chin-Liang Chen | 2022-07-12 |
| 11355461 | Integrated fan-out package and manufacturing method thereof | Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang | 2022-06-07 |
| 11315862 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Jiun Yi Wu, Yu-Min Liang, Wei-Yu Chen | 2022-04-26 |
| 11264304 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang | 2022-03-01 |
| 11244879 | Semiconductor package | Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang | 2022-02-08 |
| 11145639 | Semiconductor package and manufacturing method thereof | Jung Wei Cheng, Chien-Hsun Lee, Hao-Cheng Hou, Hsin-Yu Pan, Tsung-Ding Wang | 2021-10-12 |
| 11127644 | Planarization of semiconductor packages and structures resulting therefrom | Hai-Ming Chen, Yu-Min Liang, Jung Wei Cheng, Chien-Hsun Lee | 2021-09-21 |
| 11011431 | Semiconductor structure and manufacturing method thereof | Chien-Kuo Chang, Chih-Hao Lin, Jung-Tsung Cheng, Kuan-Lin Ho | 2021-05-18 |
| 10957672 | Package structure and method of manufacturing the same | Chin-Liang Chen, Chien-Hsun Lee, Kuan-Lin Ho, Yu-Min Liang | 2021-03-23 |