Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412862 | Package structure and manufacturing method thereof | Chi-Yang Yu, Hai-Ming Chen, Yu-Min Liang, Jiun Yi Wu | 2025-09-09 |
| 12355008 | Methods of fabricating package structure | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-07-08 |
| 12288752 | Semiconductor packages | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2025-04-29 |
| 12243681 | Programmable inductor and methods of manufacture | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2025-03-04 |
| 12119328 | Methods of fabricating the same die stack structure and semiconductor structure | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-10-15 |
| 12057439 | Integrated circuit packages | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih, Sung-Feng Yeh | 2024-08-06 |
| 12015013 | Die stack structure, semiconductor structure and method of fabricating the same | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-06-18 |
| 11810897 | Package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2023-11-07 |
| 11756731 | Programmable inductor | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2023-09-12 |
| 11742297 | Semiconductor packages | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2023-08-29 |
| 11705411 | Chip package with antenna element | Yung-Ping Chiang, Yi-Che Chiang, Min-Chien Hsiao, Chao-Wen Shih, Shou-Zen Chang +2 more | 2023-07-18 |
| 11502062 | Integrated circuit package and method | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih, Sung-Feng Yeh | 2022-11-15 |
| 11322477 | Package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2022-05-03 |
| 11264362 | Semiconductor structure and method of fabricating the same | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-03-01 |
| 11056438 | Semiconductor packages and method of forming the same | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2021-07-06 |
| 11024605 | Integrated circuit package and method | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih, Sung-Feng Yeh | 2021-06-01 |
| 11004809 | Chip package with antenna element | Yung-Ping Chiang, Yi-Che Chiang, Min-Chien Hsiao, Chao-Wen Shih, Shou-Zen Chang +2 more | 2021-05-11 |
| 10937719 | Package structure and method of fabricating the same | Yung-Ping Chiang, Chao-Wen Shih, Min-Chien Hsiao, Shou-Zen Chang, Yi-Che Chiang | 2021-03-02 |
| 10312203 | Structure and formation method of chip package with antenna element | Yung-Ping Chiang, Min-Chien Hsiao, Yi-Che Chiang, Chao-Wen Shih, Shou-Zen Chang +2 more | 2019-06-04 |
| 10269489 | Programmable inductor | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2019-04-23 |
| 9728477 | Method of manufacturing a semiconductor device having scribe lines | Chao-Wen Shih, Yung-Ping Chiang, Hao-Yi Tsai | 2017-08-08 |
| 9379067 | Semiconductor devices and methods of manufacture thereof having guard ring structure | Hsien-Wei Chen, Hung-Yi Kuo, Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2016-06-28 |
| 9343385 | Semiconductor device comprising a chip substrate, a mold, and a buffer layer | Chao-Wen Shih, Yung-Ping Chiang, Hao-Yi Tsai | 2016-05-17 |
| 9245842 | Semiconductor devices having guard ring structure and methods of manufacture thereof | Hsien-Wei Chen, Hung-Yi Kuo, Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2016-01-26 |