Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266847 | Semiconductor packages and manufacturing methods thereof | Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2025-04-01 |
| 12205888 | Semiconductor packages and methods of forming the same | Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Chang-Wen Huang +1 more | 2025-01-21 |
| 12148735 | Memory device and manufacturing method thereof | Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Chang-Wen Huang +1 more | 2024-11-19 |
| 11929319 | Integrated fan-out packages and methods of forming the same | Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Chang-Wen Huang +1 more | 2024-03-12 |
| 11855333 | Semiconductor packages and manufacturing methods thereof | Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2023-12-26 |
| 11705411 | Chip package with antenna element | Yi-Che Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih, Shou-Zen Chang +2 more | 2023-07-18 |
| 11515618 | Semiconductor packages and manufacturing methods thereof | Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2022-11-29 |
| 11335666 | Memory device and manufacturing method thereof | Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Chang-Wen Huang +1 more | 2022-05-17 |
| 11127708 | Package structure and method of manufacturing the same | Ming-Kai Liu, Han-Ping Pu, Ting-Chu Ko, Chang-Wen Huang, Yu-Sheng Hsieh | 2021-09-21 |
| 11075159 | Integrated fan-out packages and methods of forming the same | Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Chang-Wen Huang +1 more | 2021-07-27 |
| 11004809 | Chip package with antenna element | Yi-Che Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih, Shou-Zen Chang +2 more | 2021-05-11 |
| 10978782 | Semiconductor packages and manufacturing methods thereof | Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2021-04-13 |
| 10937719 | Package structure and method of fabricating the same | Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Shou-Zen Chang, Yi-Che Chiang | 2021-03-02 |
| 10879170 | Semiconductor package and manufacturing method thereof | Chung-Shi Liu, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Chang-Wen Huang +2 more | 2020-12-29 |
| 10636713 | Semiconductor packages and manufacturing methods thereof | Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2020-04-28 |
| 10504865 | Package structure and method of manufacturing the same | Ming-Kai Liu, Han-Ping Pu, Ting-Chu Ko, Chang-Wen Huang, Yu-Sheng Hsieh | 2019-12-10 |
| 10319692 | Semiconductor structure and manufacturing method thereof | Chao-Wen Shih, Hao-Yi Tsai, Mirng-Ji Lii | 2019-06-11 |
| 10312203 | Structure and formation method of chip package with antenna element | Nien-Fang Wu, Min-Chien Hsiao, Yi-Che Chiang, Chao-Wen Shih, Shou-Zen Chang +2 more | 2019-06-04 |
| 10157807 | Sensor packages and manufacturing mehtods thereof | Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2018-12-18 |
| 9728477 | Method of manufacturing a semiconductor device having scribe lines | Nien-Fang Wu, Chao-Wen Shih, Hao-Yi Tsai | 2017-08-08 |
| 9543259 | Semiconductor structure with oval shaped conductor | Chao-Wen Shih, Hao-Yi Tsai, Mirng-Ji Lii | 2017-01-10 |
| 9484308 | Semiconductor device | Ming-Kai Liu, Chao-Wen Shih | 2016-11-01 |
| 9397056 | Semiconductor device having trench adjacent to receiving area and method of forming the same | Yen-Ping Wang, Chao-Wen Shih, Shih-Wei Liang, Tsung-Yuan Yu, Hao-Yi Tsai +2 more | 2016-07-19 |
| 9379076 | Semiconductor device and manufacturing method thereof | Chen-Chih Hsieh, Hao-Yi Tsai, Chao-Wen Shih, Tsung-Yuan Yu | 2016-06-28 |
| 9343385 | Semiconductor device comprising a chip substrate, a mold, and a buffer layer | Nien-Fang Wu, Chao-Wen Shih, Hao-Yi Tsai | 2016-05-17 |