Issued Patents All Time
Showing 1–25 of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374652 | Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Ching-Jung Yang | 2025-07-29 |
| 12322670 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang | 2025-06-03 |
| 12132247 | Semiconductor package and manufacturing method thereof | Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu, Chung-Yi Hsu | 2024-10-29 |
| 12080563 | Semiconductor devices and methods of manufacturing | Chien-Hsun Chen, Yu-Min Liang, Jiun Yi Wu, Chen-Hua Yu, Kai-Chiang Wu | 2024-09-03 |
| 12062619 | Semiconductor packages and forming methods thereof | Kai-Chiang Wu, Chin-Liang Chen, Jiun Yi Wu | 2024-08-13 |
| 12046480 | Manufacturing method of a semiconductor device | Shou-Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen +3 more | 2024-07-23 |
| 11894330 | Methods of manufacturing a semiconductor device including a joint adjacent to a post | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Ching-Feng Yang +2 more | 2024-02-06 |
| 11855011 | Package structure and method of forming the same | Chung-Yi Hsu, Kai-Chiang Wu | 2023-12-26 |
| 11742219 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chung-Hao Tsai, Chun-Lin Lu, Che-Wei Hsu | 2023-08-29 |
| 11569562 | Semiconductor package and manufacturing method thereof | Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu, Chung-Yi Hsu | 2023-01-31 |
| 11515173 | Semiconductor devices and methods of manufacturing | Chien-Hsun Chen, Yu-Min Liang, Jiun Yi Wu, Chen-Hua Yu, Kai-Chiang Wu | 2022-11-29 |
| 11417616 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Han-Ping Pu | 2022-08-16 |
| 11348874 | Semiconductor packages and forming methods thereof | Kai-Chiang Wu, Chin-Liang Chen, Jiun Yi Wu | 2022-05-31 |
| 11329022 | Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Ching-Jung Yang | 2022-05-10 |
| 11239096 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chung-Hao Tsai, Chun-Lin Lu, Che-Wei Hsu | 2022-02-01 |
| 11225098 | System of assessing performance of a photocuring light source for a printing machine and a combination having same | Shih Chang Chang, Chia-Bin Chueh, Kang-Yu Liu | 2022-01-18 |
| 11211339 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2021-12-28 |
| 11114357 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang | 2021-09-07 |
| 11101238 | Surface mounting semiconductor components | Ming-Kai Liu, Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang +1 more | 2021-08-24 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Ching-Feng Yang +2 more | 2021-04-06 |
| 10964595 | Method for singulating packaged integrated circuits and resulting structures | Ming-Kai Liu, Kai-Chiang Wu | 2021-03-30 |
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Ching-Feng Yang +2 more | 2020-12-15 |
| 10770313 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chung-Hao Tsai, Chun-Lin Lu, Che-Wei Hsu | 2020-09-08 |
| 10748861 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Han-Ping Pu | 2020-08-18 |
| 10727082 | Semiconductor device and manufacturing method thereof | Shou-Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen +3 more | 2020-07-28 |