Issued Patents All Time
Showing 26–50 of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522437 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang | 2019-12-31 |
| 10510681 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2019-12-17 |
| 10312209 | Manufacturing method of semiconductor package | Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang | 2019-06-04 |
| 10276404 | Integrated fan-out package | Kai-Chiang Wu, Chung-Hao Tsai, Chun-Lin Lu, Che-Wei Hsu | 2019-04-30 |
| 10269640 | Method for singulating packaged integrated circuits and resulting structures | Ming-Kai Liu, Kai-Chiang Wu | 2019-04-23 |
| 10269588 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu +1 more | 2019-04-23 |
| 10170444 | Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Ching-Jung Yang | 2019-01-01 |
| 10163854 | Package structure and method for manufacturing thereof | Chuei-Tang Wang, Kai-Chiang Wu, Chieh-Yen Chen, Shou-Zen Chang | 2018-12-25 |
| 10163846 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Ching-Feng Yang +2 more | 2018-12-25 |
| 10043761 | Semiconductor device and manufacturing method thereof | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2018-08-07 |
| 10037959 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Shih-Wei Liang, Kai-Chiang Wu, Ming-Kai Liu | 2018-07-31 |
| 9966321 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang | 2018-05-08 |
| 9953966 | Semiconductor device and method of forming the same | Chia-Chun Miao, Shih-Wei Liang, Kai-Chiang Wu | 2018-04-24 |
| 9953942 | Semiconductor packaging and manufacturing method thereof | Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang | 2018-04-24 |
| 9941240 | Semiconductor chip scale package and manufacturing method thereof | Ming-Kai Liu, Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang +1 more | 2018-04-10 |
| 9875913 | Method for singulating packaged integrated circuits and resulting structures | Ming-Kai Liu, Kai-Chiang Wu | 2018-01-23 |
| 9818722 | Package structure and method for manufacturing thereof | Chuei-Tang Wang, Kai-Chiang Wu, Chieh-Yen Chen, Shou-Zen Chang | 2017-11-14 |
| 9806045 | Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Ching-Feng Yang +2 more | 2017-10-31 |
| 9653417 | Method for singulating packaged integrated circuits and resulting structures | Ming-Kai Liu, Kai-Chiang Wu | 2017-05-16 |
| 9627325 | Package alignment structure and method of forming same | Ming-Kai Liu, Chia-Chun Miao, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang +1 more | 2017-04-18 |
| 9596729 | Dimmable switching mode LED driving circuit without phase angle measurement | Wen-Hung Huang | 2017-03-14 |
| 9559071 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Ching-Feng Yang +2 more | 2017-01-31 |
| 9543263 | Semiconductor packaging and manufacturing method thereof | Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang | 2017-01-10 |
| 9497861 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang | 2016-11-15 |
| 9472523 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Shih-Wei Liang, Kai-Chiang Wu, Ming-Kai Liu | 2016-10-18 |