Issued Patents All Time
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412852 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2025-09-09 |
| 12322670 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang | 2025-06-03 |
| 12131986 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Hung-Jui Kuo, Kai-Chiang Wu, Ming-Che Ho | 2024-10-29 |
| 12046480 | Manufacturing method of a semiconductor device | Shou-Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Vincent Chen, Chuei-Tang Wang +3 more | 2024-07-23 |
| 11894330 | Methods of manufacturing a semiconductor device including a joint adjacent to a post | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2024-02-06 |
| 11658105 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Hung-Jui Kuo, Kai-Chiang Wu, Ming-Che Ho | 2023-05-23 |
| 11574857 | Semiconductor package and manufacturing method thereof | Hsin-Yu Pan, Kai-Chiang Wu, Chien-Chang Lin | 2023-02-07 |
| 11398440 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2022-07-26 |
| 11373922 | Semiconductor packages having thermal through vias (TTV) | Sen-Kuei Hsu, Hsin-Yu Pan, Kai-Chiang Wu, Yi-Che Chiang | 2022-06-28 |
| 11233019 | Manufacturing method of semicondcutor package | Fang-Yu Liang, Kai-Chiang Wu | 2022-01-25 |
| 11211339 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ming-Kai Liu +5 more | 2021-12-28 |
| 11114357 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang | 2021-09-07 |
| 11101238 | Surface mounting semiconductor components | Ming-Kai Liu, Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Yen-Ping Wang +1 more | 2021-08-24 |
| 11018083 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Hung-Jui Kuo, Kai-Chiang Wu, Ming-Che Ho | 2021-05-25 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2021-04-06 |
| 10950556 | EMI shielding structure in InFO package | Kai-Chiang Wu, Chen-Hua Yu, Meng-Tse Chen | 2021-03-16 |
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2020-12-15 |
| 10748831 | Semiconductor packages having thermal through vias (TTV) | Sen-Kuei Hsu, Hsin-Yu Pan, Kai-Chiang Wu, Yi-Che Chiang | 2020-08-18 |
| 10727082 | Semiconductor device and manufacturing method thereof | Shou-Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Vincent Chen, Chuei-Tang Wang +3 more | 2020-07-28 |
| 10720399 | Semicondcutor package and manufacturing method of semicondcutor package | Fang-Yu Liang, Kai-Chiang Wu | 2020-07-21 |
| 10622222 | Integrated fan-out package having multi-band antenna and method of forming the same | Nan-Chin Chuang, Kai-Chiang Wu | 2020-04-14 |
| 10522437 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang | 2019-12-31 |
| 10510681 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ming-Kai Liu +5 more | 2019-12-17 |
| 10468355 | EMI Shielding structure in InFO package | Kai-Chiang Wu, Chen-Hua Yu, Meng-Tse Chen | 2019-11-05 |
| 10312209 | Manufacturing method of semiconductor package | Chao-Wen Shih, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Yen-Ping Wang | 2019-06-04 |