Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424571 | Package structure and manufacturing method thereof | Hsin-Yu Pan | 2025-09-23 |
| 12362275 | Method of fabricating package structure including a plurality of antenna patterns | Hsin-Yu Pan, Yi-Che Chiang | 2025-07-15 |
| 12266648 | Package structure | Hsin-Yu Pan, Ming-Hsien Tsai | 2025-04-01 |
| 12051666 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Yi-Yang Lei +2 more | 2024-07-30 |
| 12021024 | Semiconductor device including a semiconductor die and a plurality of antenna patterns | Hsin-Yu Pan, Yi-Che Chiang | 2024-06-25 |
| 12014992 | Semiconductor package | Hsin-Yu Pan, Chien-Chang Lin | 2024-06-18 |
| 11942442 | Package structure and manufacturing method thereof | Hsin-Yu Pan | 2024-03-26 |
| 11894299 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hsin-Yu Pan, Hao-Yi Tsai | 2024-02-06 |
| 11852672 | Test circuit and method | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Chuan-Ching Wang, Hao Chen | 2023-12-26 |
| 11824054 | Package structure | Hsin-Yu Pan, Ming-Hsien Tsai | 2023-11-21 |
| 11631993 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chen-Hua Yu, Chita Chuang, Chen-Shien Chen, Ming Hung Tseng, Yu-Feng Chen +1 more | 2023-04-18 |
| 11532576 | Semiconductor package and manufacturing method thereof | Hsin-Yu Pan, Yi-Che Chiang | 2022-12-20 |
| 11508666 | Semiconductor package | Hsin-Yu Pan, Chien-Chang Lin | 2022-11-22 |
| 11467203 | Test circuit and method | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Chuan-Ching Wang, Hao Chen | 2022-10-11 |
| 11444023 | Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device | Hsin-Yu Pan, Yi-Che Chiang | 2022-09-13 |
| 11373922 | Semiconductor packages having thermal through vias (TTV) | Ching-Feng Yang, Hsin-Yu Pan, Kai-Chiang Wu, Yi-Che Chiang | 2022-06-28 |
| 11355466 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Yi-Yang Lei +2 more | 2022-06-07 |
| 11322453 | Semiconductor package having channels formed between through-insulator-vias | — | 2022-05-03 |
| 11296067 | Package structure | Hsin-Yu Pan, Ming-Hsien Tsai | 2022-04-05 |
| 11249112 | Devices for high-density probing techniques and method of implementing the same | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Wei-Hsun Lin, De-Jian Liu | 2022-02-15 |
| 10937734 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hsin-Yu Pan, Hao-Yi Tsai | 2021-03-02 |
| 10872842 | Semiconductor device and manufacturing method thereof | Albert Wan, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Han-Ping Pu +1 more | 2020-12-22 |
| 10867882 | Semiconductor package, semiconductor device and method for packaging semiconductor device | Albert Wan, Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan | 2020-12-15 |
| 10840197 | Package structure and manufacturing method thereof | Hsin-Yu Pan | 2020-11-17 |
| 10818588 | Semiconductor device, package structure and method of fabricating the same | Hsin-Yu Pan, Yi-Che Chiang | 2020-10-27 |