Issued Patents All Time
Showing 1–25 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11852672 | Test circuit and method | Mill-Jer Wang, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen | 2023-12-26 |
| 11726112 | Electromagnetic shielding during wafer stage testing | Hsien-Tang Wang, Mill-Jer Wang, Chi-Chang Lai | 2023-08-15 |
| 11579190 | Testing holders for chip unit and die package | Mill-Jer Wang, Kuo-Chuan Liu, Hung-Chih Lin, Hao Chen | 2023-02-14 |
| 11467203 | Test circuit and method | Mill-Jer Wang, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen | 2022-10-11 |
| 11387683 | Composite integrated circuits and methods for wireless interactions therewith | Min-Jer Wang, Chewn-Pu Jou, Feng-Wei Kuo, Hao Chen, Hung-Chih Lin +4 more | 2022-07-12 |
| 11340291 | Testing holders for chip unit and die package | Mill-Jer Wang, Kuo-Chuan Liu, Hung-Chih Lin, Hao Chen | 2022-05-24 |
| 11249112 | Devices for high-density probing techniques and method of implementing the same | Mill-Jer Wang, Hung-Chih Lin, Wei-Hsun Lin, Sen-Kuei Hsu, De-Jian Liu | 2022-02-15 |
| 11231453 | Alignment testing for tiered semiconductor structure | Mill-Jer Wang, Hung-Chih Lin, Hao Chen, Mincent Lee | 2022-01-25 |
| 11229109 | Three dimensional integrated circuit electrostatic discharge protection and prevention test interface | Mill-Jer Wang, Hung-Chih Lin, Hao-Chiang Cheng | 2022-01-18 |
| 10790707 | Composite integrated circuits and methods for wireless interactions therewith | Min-Jer Wang, Chewn-Pu Jou, Feng-Wei Kuo, Hao Chen, Hung-Chih Lin +4 more | 2020-09-29 |
| 10725090 | Test circuit and method | Mill-Jer Wang, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen | 2020-07-28 |
| 10718790 | Devices for high-density probing techniques and method of implementing the same | Mill-Jer Wang, Hung-Chih Lin, Wei-Hsun Lin, Sen-Kuei Hsu, De-Jian Liu | 2020-07-21 |
| 10698026 | Testing holders for chip unit and die package | Mill-Jer Wang, Kuo-Chuan Liu, Hung-Chih Lin, Hao Chen | 2020-06-30 |
| 10652987 | Three dimensional integrated circuit electrostatic discharge protection and prevention test interface | Mill-Jer Wang, Hung-Chih Lin, Hao-Chiang Cheng | 2020-05-12 |
| 10641819 | Alignment testing for tiered semiconductor structure | Mill-Jer Wang, Hung-Chih Lin, Hao Chen, Mincent Lee | 2020-05-05 |
| 10274518 | Devices for high-density probing techniques and method of implementing the same | Mill-Jer Wang, Hung-Chih Lin, Wei-Hsun Lin, Sen-Kuei Hsu, De-Jian Liu | 2019-04-30 |
| 10164480 | Composite integrated circuits and methods for wireless interactions therewith | Min-Jer Wang, Chewn-Pu Jou, Feng-Wei Kuo, Hao Chen, Hung-Chih Lin +4 more | 2018-12-25 |
| 10073135 | Alignment testing for tiered semiconductor structure | Mill-Jer Wang, Hung-Chih Lin, Hao Chen, Mincent Lee | 2018-09-11 |
| 10067181 | Testing holders for chip unit and die package | Mill-Jer Wang, Kuo-Chuan Liu, Hung-Chih Lin, Hao Chen | 2018-09-04 |
| 10002829 | Semiconductor device and manufacturing method thereof | Hao Chen, Chen-Hsiang Hsu, Hung-Chih Lin, Mill-Jer Wang | 2018-06-19 |
| 9952279 | Apparatus for three dimensional integrated circuit testing | Mill-Jer Wang, Hung-Chih Lin, Hao Chen, Chung-Han Huang, Chung-Sheng Yuan +3 more | 2018-04-24 |
| 9915699 | Integrated fan-out pillar probe system | Mill-Jer Wang, Hung-Chih Lin, Hao Chen, Mincent Lee, Chen-Hung Tien +1 more | 2018-03-13 |
| 9900970 | Three dimensional integrated circuit electrostatic discharge protection and prevention test interface | Mill-Jer Wang, Hung-Chih Lin, Hao Chen | 2018-02-20 |
| 9891266 | Test circuit and method | Mill-Jer Wang, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen | 2018-02-13 |
| 9880201 | Systems for probing semiconductor wafers | Mill-Jer Wang, Hung-Chih Lin, Hao Chen | 2018-01-30 |