Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764169 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin | 2023-09-19 |
| 11579190 | Testing holders for chip unit and die package | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Hao Chen | 2023-02-14 |
| 11340291 | Testing holders for chip unit and die package | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Hao Chen | 2022-05-24 |
| 11329006 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin | 2022-05-10 |
| 10698026 | Testing holders for chip unit and die package | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Hao Chen | 2020-06-30 |
| 10685920 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin | 2020-06-16 |
| 10163862 | Package structure and method for forming same | Hsien-Wei Chen | 2018-12-25 |
| 10067181 | Testing holders for chip unit and die package | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Hao Chen | 2018-09-04 |
| 10008480 | Package-on-package structure with through molding via | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin | 2018-06-26 |
| 9831190 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin | 2017-11-28 |
| 9780076 | Package-on-package structure with through molding via | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin | 2017-10-03 |
| 9664707 | Testing holders for chip unit and die package | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Hao Chen | 2017-05-30 |
| 9543284 | 3D packages and methods for forming the same | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin, Wen-Yi Lin | 2017-01-10 |
| 9520385 | Package structure and method for forming same | Hsien-Wei Chen | 2016-12-13 |
| 9502387 | Package-on-package structure with through molding via | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin | 2016-11-22 |
| 9502323 | Method of forming encapsulated semiconductor device package | Wen-Yi Lin, Po-Yao Lin, Cheng-Yi Hong, Ming-Chih Yew | 2016-11-22 |
| 9453877 | Testing holders for chip unit and die package | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Hao Chen | 2016-09-27 |
| 9341671 | Testing holders for chip unit and die package | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Hao Chen | 2016-05-17 |
| 9252076 | 3D packages and methods for forming the same | Ming-Chih Yew, Wen-Yi Lin, Fu-Jen Li, Po-Yao Lin | 2016-02-02 |
| 9237647 | Package-on-package structure with through molding via | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin | 2016-01-12 |
| 8962388 | Method and apparatus for supporting a computer chip on a printed circuit board assembly | Mohan R. Nagar, Mudasir Ahmad, Bangalore J. Shanker, Jie Xue | 2015-02-24 |
| 8941248 | Semiconductor device package and method | Wen-Yi Lin, Ming-Chih Yew, Cheng-Yi Hong, Po-Yao Lin | 2015-01-27 |
| 8901732 | Semiconductor device package and method | Ming-Chih Yew, Fu-Jen Li, Wen-Yi Lin, Po-Yao Lin | 2014-12-02 |
| 8736044 | Lid for an electrical hardware component | Mudasir Ahmad, Mohan R. Nagar, Bangalore J. Shanker | 2014-05-27 |
| 8453167 | Locking mechanism and an optical disk drive having the same | Che-Sheng Yang | 2013-05-28 |