Issued Patents All Time
Showing 1–25 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12398452 | Metal mask | Yun-Heng Chen | 2025-08-26 |
| 12327782 | Systems for semiconductor package mounting with improved co-planarity | Kuang-Chun Lee, Chien-Chen Li, Chen-Shien Chen | 2025-06-10 |
| 12278156 | Semiconductor package | Chin-Hua Wang, Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Shu-Shen Yeh | 2025-04-15 |
| 12247831 | Method of inspecting flatness of substrate | Chin-Wang Hsu | 2025-03-11 |
| 12119276 | Package structure with protective lid | Kuang-Chun Lee, Chien-Chen Li, Chen-Shien Chen | 2024-10-15 |
| 12024780 | Method of preparing metal mask substrate | Chi-Wei Lin | 2024-07-02 |
| 12019097 | Method for forming probe head structure | Hao Chen, Chuan-Hsiang Sun, Mill-Jer Wang, Chien-Chen Li, Chen-Shien Chen | 2024-06-25 |
| 12000693 | Method of inspecting flatness of substrate | Chin-Wang Hsu | 2024-06-04 |
| 11980043 | Display panel metal mask improvced quality standard detection and inspecting method thereof | Yun Yang, Mei-Lun Li | 2024-05-07 |
| 11868184 | Metal backplate and foldable display using the same | Ching Wen Tao | 2024-01-09 |
| 11862528 | Method for forming semiconductor package | Chin-Hua Wang, Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Shu-Shen Yeh | 2024-01-02 |
| 11764118 | Structure and formation method of chip package with protective lid | Kuang-Chun Lee, Chien-Chen Li, Chen-Shien Chen | 2023-09-19 |
| 11685985 | Method of manufacturing metal mask | Yun-Heng Chen | 2023-06-27 |
| 11011447 | Semiconductor package and method for forming the same | Chin-Hua Wang, Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Shu-Shen Yeh | 2021-05-18 |
| 10790164 | Method for forming package structure | Che-Chia Yang, Kuang-Chun Lee, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2020-09-29 |
| 10361190 | Standard cell circuitries | Kin-Hooi Dia, Hugh Mair, Shao-Hua Huang | 2019-07-23 |
| 10305480 | Voltage generating circuit and ESD protecting method | — | 2019-05-28 |
| 10269602 | Wafer warpage inspection system and method using the same | Po-Yao Lin, Shin-Puu Jeng | 2019-04-23 |
| D834575 | Display | Yu-Tsung Su | 2018-11-27 |
| 10126363 | Flip-flop circuit and scan chain using the same | Girishankar Gurumurthy | 2018-11-13 |
| D832839 | Display | Yu-Tsung Su | 2018-11-06 |
| 9887144 | Ring structure for chip packaging | Yu-Chih Liu, Ming-Chih Yew, Tsung-Shu Lin, Bor-Rung Su, Jing Ruei Lu +1 more | 2018-02-06 |
| 9881908 | Integrated fan-out package on package structure and methods of forming same | Hsien-Wen Liu, Po-Yao Lin, Cheng-Lin Huang, Shyue-Ter Leu, Shin-Puu Jeng | 2018-01-30 |
| 9748156 | Semiconductor package assembly, semiconductor package and forming method thereof | Shu-Shen Yeh, Cheng-Lin Huang, Chin-Hua Wang, Kuang-Chun Lee, Ming-Chih Yew +4 more | 2017-08-29 |
| 9721868 | Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate | Po-Yao Lin, Shyue-Ter Leu, Ming-Chih Yew, Shu-Shen Yeh | 2017-08-01 |