Issued Patents All Time
Showing 1–25 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431415 | Buffer block structures for C4 bonding and methods of using the same | Li-Ling Liao, Ming-Chih Yew, Chia-Kuei Hsu, Po-Yao Lin | 2025-09-30 |
| 12424532 | Bump joint structure with distortion and method forming same | Po-Yao Lin | 2025-09-23 |
| 12424511 | High efficiency heat dissipation using discrete thermal interface material films | Yu-Chen Lee, Shu-Shen Yeh, Chia-Kuei Hsu, Po-Yao Lin | 2025-09-23 |
| 12424586 | Bridging-resistant microbump structures and methods of forming the same | Han-Hsiang Huang, Yen-Hao Chen, Chien-Sheng Chen | 2025-09-23 |
| 12417970 | Method for forming chip package structure | Chin-Hua Wang, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin | 2025-09-16 |
| 12412827 | Semiconductor die package with conductive line crack prevention design | Ya Huei Lee, Shu-Shen Yeh, Kuo-Ching Hsu, Shyue-Ter Leu, Po-Yao Lin | 2025-09-09 |
| 12412851 | Semiconductor device and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Ming-Chih Yew | 2025-09-09 |
| 12406936 | Semiconductor package with substrate recess and methods for forming the same | Ming-Chih Yew, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin | 2025-09-02 |
| 12406897 | Package structure with buffer layer embedded in lid layer | Shu-Shen Yeh, Yu-Sheng Lin, Ming-Chih Yew, Po-Yao Lin | 2025-09-02 |
| 12406898 | Chip package structure with lid | Shu-Shen Yeh, Che-Chia Yang, Yu-Sheng Lin, Chin-Hua Wang, Po-Yao Lin | 2025-09-02 |
| 12400999 | Semiconductor devices and methods of manufacture | Hsien-Wei Chen | 2025-08-26 |
| 12394758 | Packages with metal line crack prevention design | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2025-08-19 |
| 12394698 | Underfill cushion films for packaging substrates and methods of forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin | 2025-08-19 |
| 12394752 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin | 2025-08-19 |
| 12387945 | Semiconductor structures including glass core layer and methods of forming the same | Jing-Ye Juang, Hsien-Wei Chen | 2025-08-12 |
| 12387991 | Manufacturing method of semiconductor package | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin | 2025-08-12 |
| 12387992 | Package and method for forming the same | Yu-Sheng Lin, Chien-Tung Yu, Chia-Hsiang Lin, Chin-Hua Wang | 2025-08-12 |
| 12388028 | Package structure | Yi-Wen Wu, Shih-Ting Hung, Po-Yao Chuang | 2025-08-12 |
| 12381180 | Multi-chip packages and methods of forming the same | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Hsiao-Wen Lee | 2025-08-05 |
| 12374561 | Chip package structure with ring dam | Yu-Sheng Lin, Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang | 2025-07-29 |
| 12374636 | Semiconductor device package with stress reduction design | Shu-Shen Yeh, Chin-Hua Wang, Po-Chen Lai, Po-Yao Lin | 2025-07-29 |
| 12368109 | Interposer structure for semiconductor package including peripheral metal pad around alignment mark and methods of fabricating same | Hsien-Wei Chen, Meng-Liang Lin | 2025-07-22 |
| 12368114 | Semiconductor device package having warpage control and method of forming the same | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin | 2025-07-22 |
| 12368142 | Double side integration semiconductor package and method of forming the same | Monsen Liu, Shang-Lun Tsai, Shuo-Mao Chen | 2025-07-22 |
| 12368080 | Chip package structure with ring structure | Shu-Shen Yeh, Po-Yao Lin, Po-Chen Lai, Kuang-Chun Lee, Che-Chia Yang +2 more | 2025-07-22 |