Issued Patents All Time
Showing 1–25 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412827 | Semiconductor die package with conductive line crack prevention design | Ya Huei Lee, Shu-Shen Yeh, Shyue-Ter Leu, Po-Yao Lin, Shin-Puu Jeng | 2025-09-09 |
| 12388003 | Chip package structure with metal-containing layer | Yu-Huan Chen, Chen-Shien Chen | 2025-08-12 |
| 12354884 | Method for making a packaging substrate | Shyue-Ter Leu | 2025-07-08 |
| 12125715 | Chip package structure with nickel layer | Yu-Huan Chen, Chen-Shien Chen | 2024-10-22 |
| 12040266 | Package substrate, package using the same, and method of manufacturing the same | Hungen Hsu, Wei-Tien Shen | 2024-07-16 |
| 12027435 | Packages including multiple encapsulated substrate blocks and overlapping redistribution structures | Chen-Shien Chen, Wei-Hung Lin, Hui-Min Huang, Ming-Da Cheng, Mirng-Ji Lii | 2024-07-02 |
| 12002746 | Chip package structure with metal-containing layer | Yu-Huan Chen, Chen-Shien Chen | 2024-06-04 |
| 11990428 | Bonding structures in semiconductor packaged device and method of forming same | Hao-Chun Liu, Ching-Wen Hsiao, Mirng-Ji Lii | 2024-05-21 |
| 11854956 | Semiconductor die package with conductive line crack prevention design | Ya Huei Lee, Shu-Shen Yeh, Shyue-Ter Leu, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11848270 | Chip structure and method for forming the same | Hong-Seng Shue, Sheng-Han Tsai, Kuo-Chin Chang, Mirng-Ji Lii | 2023-12-19 |
| 11842935 | Method for forming a reconstructed package substrate comprising substrates blocks | Chen-Shien Chen, Wei-Hung Lin, Hui-Min Huang, Ming-Da Cheng, Mirng-Ji Lii | 2023-12-12 |
| 11830745 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2023-11-28 |
| 11728180 | Chip package structure with conductive adhesive layer | Yu-Huan Chen, Chen-Shien Chen | 2023-08-15 |
| 11532583 | Semiconductor structure and manufacturing method thereof | Kuo-Chin Chang, Yen-Kun Lai, Mirng-Ji Lii | 2022-12-20 |
| 11393771 | Bonding structures in semiconductor packaged device and method of forming same | Hao-Chun Liu, Ching-Wen Hsiao, Mirng-Ji Lii | 2022-07-19 |
| 11335634 | Chip package structure and method for forming the same | Yu-Huan Chen, Chen-Shien Chen | 2022-05-17 |
| 11302537 | Chip package structure with conductive adhesive layer and method for forming the same | Yu-Huan Chen, Chen-Shien Chen | 2022-04-12 |
| 11244919 | Package structure and method of fabricating the same | Ching-Wen Hsiao, Chen-Shien Chen, Mirng-Ji Lii | 2022-02-08 |
| 11152312 | Packages with interposers and methods for forming the same | Sao-Ling Chiu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou, Shin-Puu Jeng +1 more | 2021-10-19 |
| 11075173 | Semiconductor device and method of forming same | Chih-Hsiang Tseng, Yu-Feng Chen, Cheng-Jen Lin, Wen-Hsiung Lu, Ming-Da Cheng +4 more | 2021-07-27 |
| 11069539 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2021-07-20 |
| 10985124 | Semiconductor structure and manufacturing method thereof | Kuo-Chin Chang, Yen-Kun Lai, Mirng-Ji Lii | 2021-04-20 |
| 10665474 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2020-05-26 |
| 10276525 | Package structure and method of fabricating the same | Ching-Wen Hsiao, Chen-Shien Chen, Mirng-Ji Lii | 2019-04-30 |
| 10276532 | Three-dimensional chip stack and method of forming the same | Wei-Ming Chen, Cheng-Hsien Hsieh, Sung-Hui Huang | 2019-04-30 |