Issued Patents All Time
Showing 1–25 of 111 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431365 | Bump structure and method of making the same | Ming-Da Cheng, Su-Fei Lin, Hsu-Lun Liu, Chien-Pin Chan, Yung-Sheng Lin | 2025-09-30 |
| 12300644 | Die bonding pads and methods of forming the same | Ming-Da Cheng, Chia-Li Lin, Yu-Chih Huang, Chen-Shien Chen | 2025-05-13 |
| 12300580 | Semiconductor device and method | Hsu-Lun Liu, Ming-Da Cheng, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2025-05-13 |
| 12266593 | Method of forming semiconductor device having at least one via including concave portions on sidewall | Ting-Li Yang, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku | 2025-04-01 |
| 12255166 | Semiconductor package structure comprising via structure and redistribution layer structure | Neng-Chieh CHANG, Po-Hao Tsai, Ming-Da Cheng, Hsu-Lun Liu | 2025-03-18 |
| 12209013 | Arched membrane structure for MEMS device | Jhao-Yi Wang, Chin-Yu Ku, Lung-Kai Mao, Ming-Da Cheng | 2025-01-28 |
| 12134557 | Arched membrane structure for MEMS device | Jhao-Yi Wang, Chin-Yu Ku, Lung-Kai Mao, Ming-Da Cheng | 2024-11-05 |
| 12040256 | Semiconductor device and method | Hsu-Lun Liu, Ming-Da Cheng, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2024-07-16 |
| 12033870 | Bump structure and method of making the same | Ming-Da Cheng, Su-Fei Lin, Hsu-Lun Liu, Chien-Pin Chan, Yung-Sheng Lin | 2024-07-09 |
| 12009256 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao, Yung-Sheng Lin | 2024-06-11 |
| 11961762 | Package component with stepped passivation layer | Ming-Da Cheng, Tzy-Kuang Lee, Song-Bor Lee, Po-Hao Tsai, Wen-Che Chang | 2024-04-16 |
| 11961944 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Cheng-Jen Lin, Chin Wei Kang +1 more | 2024-04-16 |
| 11942445 | Semiconductor device with conductive pad | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Cheng-Jen Lin, Ming-Da Cheng +1 more | 2024-03-26 |
| 11942398 | Semiconductor device having at least one via including concave portions on sidewall | Ting-Li Yang, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku | 2024-03-26 |
| 11901266 | Semiconductor device structure and method for forming the same | Ting-Li Yang, Lung-Kai Mao, Fu Wei Liu, Mirng-Ji Lii | 2024-02-13 |
| 11894241 | Heterogeneous bonding structure and method forming same | Mirng-Ji Lii, Chen-Shien Chen, Lung-Kai Mao, Ming-Da Cheng | 2024-02-06 |
| 11854835 | Heterogeneous bonding structure and method forming same | Mirng-Ji Lii, Chen-Shien Chen, Lung-Kai Mao, Ming-Da Cheng | 2023-12-26 |
| 11851321 | Micro-electro mechanical system and manufacturing method thereof | Ting-Li Yang, Kai-Di Wu, Ming-Da Cheng, Cheng-Jen Lin, Chin Wei Kang | 2023-12-26 |
| 11817413 | Semiconductor package structure comprising via structure and redistribution layer structure and method for forming the same | Neng-Chieh CHANG, Po-Hao Tsai, Ming-Da Cheng, Hsu-Lun Liu | 2023-11-14 |
| 11776881 | Semiconductor device and method | Hsu-Lun Liu, Ming-Da Cheng, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2023-10-03 |
| 11769716 | Semiconductor device and methods of forming the same | Yung-Sheng Lin, Cheng-Lung Yang, Chin-Yu Ku, Ming-Da Cheng, Tang-Wei Huang +1 more | 2023-09-26 |
| 11721579 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao, Yung-Sheng Lin | 2023-08-08 |
| 11594508 | Redistribution lines having nano columns and method forming same | Po-Hao Tsai, Ming-Da Cheng, Hsu-Lun Liu, Kai-Di Wu, Su-Fei Lin | 2023-02-28 |
| 11569419 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Cheng-Jen Lin, Chin Wei Kang +1 more | 2023-01-31 |
| 11527490 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng | 2022-12-13 |