Issued Patents All Time
Showing 26–50 of 111 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450567 | Package component with stepped passivation layer | Ming-Da Cheng, Tzy-Kuang Lee, Song-Bor Lee, Po-Hao Tsai, Wen-Che Chang | 2022-09-20 |
| 11417539 | Bump structure and method of making the same | Ming-Da Cheng, Su-Fei Lin, Hsu-Lun Liu, Chien-Pin Chan, Yung-Sheng Lin | 2022-08-16 |
| 11387143 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao, Yung-Sheng Lin | 2022-07-12 |
| 11289404 | Semiconductor device and method | Hsu-Lun Liu, Ming-Da Cheng, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2022-03-29 |
| 11177137 | Wafer etching process and methods thereof | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chen-En Yen, Hsu-Lun Liu | 2021-11-16 |
| 11171100 | Semiconductor device structure with protected bump and method of forming the same | Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng, Chang-Jung Hsueh, Kuan-Liang Lai | 2021-11-09 |
| 11152319 | Micro-connection structure and manufacturing method thereof | Chen-Shien Chen, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang, Kai Jun Zhan | 2021-10-19 |
| 11101233 | Semiconductor device and method for forming the same | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Cheng-Jen Lin, Ming-Da Cheng +1 more | 2021-08-24 |
| 11094655 | Semiconductor structure and method for forming the same | Chang-Jung Hsueh, Chin Wei Kang, Hui-Min Huang, Wei-Hung Lin, Cheng-Jen Lin +2 more | 2021-08-17 |
| 11075173 | Semiconductor device and method of forming same | Chih-Hsiang Tseng, Yu-Feng Chen, Cheng-Jen Lin, Ming-Da Cheng, Kuo-Ching Hsu +4 more | 2021-07-27 |
| 11043463 | Interconnect structures and methods of forming same | Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2021-06-22 |
| 10811369 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng | 2020-10-20 |
| 10770366 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Yian-Liang Kuo | 2020-09-08 |
| 10714442 | Interconnect structures and methods of forming same | Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2020-07-14 |
| 10700033 | Packaging device and method of making the same | Chang-Chia Huang, Tsung-Shu Lin, Ming-Da Cheng, Bor-Rung Su | 2020-06-30 |
| 10665565 | Package assembly | Hung-Jen Lin, Tsung-Ding Wang, Chien-Hsiun Lee, Ming-Da Cheng, Chung-Shi Liu | 2020-05-26 |
| 10651142 | Micro-connection structure and manufacturing method thereof | Chen-Shien Chen, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang, Kai Jun Zhan | 2020-05-12 |
| 10522480 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng | 2019-12-31 |
| 10510635 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Yian-Liang Kuo | 2019-12-17 |
| 10283471 | Micro-connection structure and manufacturing method thereof | Chen-Shien Chen, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang, Kai Jun Zhan | 2019-05-07 |
| 10262964 | Interconnect structures and methods of forming same | Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2019-04-16 |
| 10192848 | Package assembly | Hung-Jen Lin, Tsung-Ding Wang, Chien-Hsiun Lee, Ming-Da Cheng, Chung-Shi Liu | 2019-01-29 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng +6 more | 2018-11-20 |
| 10128206 | Conductive pillar structure | Chih-Wei Lin, Ming-Da Cheng, Meng-Wei Chou, Hung-Jui Kuo, Chung-Shi Liu | 2018-11-13 |
| 10079213 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng | 2018-09-18 |