Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230595 | Metal bumps and method forming same | Ming-Da Cheng, Yung-Ching Chao, Chun-Kai Tzeng, Cheng-Jen Lin, Yu-Feng Chen +1 more | 2025-02-18 |
| 12009256 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Wen-Hsiung Lu, Yung-Han Chuang, Lung-Kai Mao, Yung-Sheng Lin | 2024-06-11 |
| 11961944 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Wen-Hsiung Lu, Cheng-Jen Lin +1 more | 2024-04-16 |
| 11942445 | Semiconductor device with conductive pad | Chen-En Yen, Kai Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng +1 more | 2024-03-26 |
| 11851321 | Micro-electro mechanical system and manufacturing method thereof | Ting-Li Yang, Kai-Di Wu, Ming-Da Cheng, Wen-Hsiung Lu, Cheng-Jen Lin | 2023-12-26 |
| 11742204 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Kai Jun Zhan, Wei-Hung Lin, Cheng-Jen Lin +3 more | 2023-08-29 |
| 11721579 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Wen-Hsiung Lu, Yung-Han Chuang, Lung-Kai Mao, Yung-Sheng Lin | 2023-08-08 |
| 11569419 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Wen-Hsiung Lu, Cheng-Jen Lin +1 more | 2023-01-31 |
| 11387143 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Wen-Hsiung Lu, Yung-Han Chuang, Lung-Kai Mao, Yung-Sheng Lin | 2022-07-12 |
| 11152319 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-Shien Chen, Chen-En Yen, Cheng-Jen Lin, Kai Jun Zhan | 2021-10-19 |
| 11101233 | Semiconductor device and method for forming the same | Chen-En Yen, Kai Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng +1 more | 2021-08-24 |
| 11094655 | Semiconductor structure and method for forming the same | Wen-Hsiung Lu, Chang-Jung Hsueh, Hui-Min Huang, Wei-Hung Lin, Cheng-Jen Lin +2 more | 2021-08-17 |
| 11024593 | Metal bumps and method forming same | Ming-Da Cheng, Yung-Ching Chao, Chun-Kai Tzeng, Cheng-Jen Lin, Yu-Feng Chen +1 more | 2021-06-01 |
| 11004685 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Kai Jun Zhan, Wei-Hung Lin, Cheng-Jen Lin +3 more | 2021-05-11 |
| 10651142 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-Shien Chen, Chen-En Yen, Cheng-Jen Lin, Kai Jun Zhan | 2020-05-12 |
| 10283471 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-Shien Chen, Chen-En Yen, Cheng-Jen Lin, Kai Jun Zhan | 2019-05-07 |