Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230595 | Metal bumps and method forming same | Ming-Da Cheng, Chun-Kai Tzeng, Cheng-Jen Lin, Chin Wei Kang, Yu-Feng Chen +1 more | 2025-02-18 |
| 12136644 | Process for tuning via profile in dielectric material | Chun-Kai Tzeng, Cheng-Jen Lin, Ming-Da Cheng, Mirng-Ji Lii | 2024-11-05 |
| 11532692 | Process for tuning via profile in dielectric material | Chun-Kai Tzeng, Cheng-Jen Lin, Ming-Da Cheng, Mirng-Ji Lii | 2022-12-20 |
| 11024593 | Metal bumps and method forming same | Ming-Da Cheng, Chun-Kai Tzeng, Cheng-Jen Lin, Chin Wei Kang, Yu-Feng Chen +1 more | 2021-06-01 |
| 10910466 | Process for tuning via profile in dielectric material | Chun-Kai Tzeng, Cheng-Jen Lin, Ming-Da Cheng, Mirng-Ji Lii | 2021-02-02 |