Issued Patents All Time
Showing 1–25 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431365 | Bump structure and method of making the same | Wen-Hsiung Lu, Su-Fei Lin, Hsu-Lun Liu, Chien-Pin Chan, Yung-Sheng Lin | 2025-09-30 |
| 12431446 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2025-09-30 |
| 12426284 | Semiconductor device with inductive component and method of forming | Mei-Chi Lee, Chi-Cheng Chen, Wei-Li Huang, Kai-Meng Tzeng, Chun-Yi Wu | 2025-09-23 |
| 12417992 | Chip structure with conductive pillar and method for forming the same | Shan-Yu Huang, Hsiao-Wen Chung, Ching-Wen Hsiao, LI-CHUN HUNG, Yuan-Yao Chang +1 more | 2025-09-16 |
| 12412858 | Semiconductor device structure with conductive bumps | Hui-Min Huang, Wei-Hung Lin, Chang-Jung Hsueh, Kai Jun Zhan, Yung-Sheng Lin | 2025-09-09 |
| 12394736 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Chung-Shi Liu, Chen-Hua Yu | 2025-08-19 |
| 12381171 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Hui-Min Huang, Wei-Hung Lin, Kai Jun Zhan, Chang-Jung Hsueh, Wan-Yu Chiang | 2025-08-05 |
| 12374639 | Non-DMSO stripper for advance package metal plating process | Tzu-Yang Lin, Chen-Yu Liu, Yung-Han Chuang, Ching-Yu Chang | 2025-07-29 |
| 12368120 | Semiconductor device and method | Chen-Shien Chen, Ting-Li Yang, Po-Hao Tsai, Chien-Chen Li | 2025-07-22 |
| 12300644 | Die bonding pads and methods of forming the same | Wen-Hsiung Lu, Chia-Li Lin, Yu-Chih Huang, Chen-Shien Chen | 2025-05-13 |
| 12300580 | Semiconductor device and method | Hsu-Lun Liu, Wen-Hsiung Lu, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2025-05-13 |
| 12300652 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2025-05-13 |
| 12288730 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Chang-Jung Hsueh, Cheng-Nan Lin, Wan-Yu Chiang, Wei-Hung Lin, Ching-Wen Hsiao | 2025-04-29 |
| 12272664 | Semiconductor packages having conductive pillars with inclined surfaces | Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Young-Hwa Wu, Tao-Sheng Chang | 2025-04-08 |
| 12255166 | Semiconductor package structure comprising via structure and redistribution layer structure | Neng-Chieh CHANG, Po-Hao Tsai, Wen-Hsiung Lu, Hsu-Lun Liu | 2025-03-18 |
| 12255131 | Capacitor between two passivation layers with different etching rates | Chia-Ming Huang, Songbor Lee, Jung-You Chen, Ching-Hua Kuan, Tzy-Kuang Lee | 2025-03-18 |
| 12243837 | Semiconductor device and method | Ting-Li Yang, Po-Hao Tsai, Yung-Han Chuang, Hsueh-Sheng Wang | 2025-03-04 |
| 12237215 | Semiconductor structure and method for manufacturing same | Xing Jin, Ran Li | 2025-02-25 |
| 12237320 | Package structure and method of forming the same | Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Wan-Yu Chiang, Mirng-Ji Lii | 2025-02-25 |
| 12230595 | Metal bumps and method forming same | Yung-Ching Chao, Chun-Kai Tzeng, Cheng-Jen Lin, Chin Wei Kang, Yu-Feng Chen +1 more | 2025-02-18 |
| 12230597 | Package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ching-Hua Hsieh +1 more | 2025-02-18 |
| 12209013 | Arched membrane structure for MEMS device | Jhao-Yi Wang, Chin-Yu Ku, Wen-Hsiung Lu, Lung-Kai Mao | 2025-01-28 |
| 12193222 | Semiconductor structure and method for forming semiconductor structure | Ran Li, Leilei Duan, Xing Jin | 2025-01-07 |
| 12142594 | Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices | Kuei-Wei Huang, Hsiu-Jen Lin, Ai-Tee Ang, Chung-Shi Liu | 2024-11-12 |
| 12144065 | Warpage control in the packaging of integrated circuits | Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2024-11-12 |