Issued Patents All Time
Showing 1–25 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431452 | Semiconductor package including corner bumps coaxially offset from the pads and non-corner bumps coaxially aligned with the pads | Chiang-Jui Chu, Hao-Chun Liu | 2025-09-30 |
| 12422293 | Server and air duct sensing method | Po-Sheng Su, Hsien-Yu Wang, Tzu-Shun Wang | 2025-09-23 |
| 12417992 | Chip structure with conductive pillar and method for forming the same | Shan-Yu Huang, Ming-Da Cheng, Hsiao-Wen Chung, LI-CHUN HUNG, Yuan-Yao Chang +1 more | 2025-09-16 |
| 12334476 | Semiconductor device with discrete blocks | Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu | 2025-06-17 |
| 12288730 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Chang-Jung Hsueh, Cheng-Nan Lin, Wan-Yu Chiang, Wei-Hung Lin, Ming-Da Cheng | 2025-04-29 |
| 12272664 | Semiconductor packages having conductive pillars with inclined surfaces | Chiang-Jui Chu, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2025-04-08 |
| 12114450 | Electronic device | Chia-Hung Yen | 2024-10-08 |
| 12057468 | Semiconductor device with inductor windings around a core above an encapsulated die | Chien-Hsien Kuo, Hon-Lin Huang, Han-Yi Lu, Alexander Kalnitsky | 2024-08-06 |
| 12057423 | Bump integration with redistribution layer | Ting-Li Yang, Po-Hao Tsai, Hong-Seng Shue, Ming-Da Cheng | 2024-08-06 |
| 12051622 | Passivation layer and planarization layer and method of forming the same | Ming-Da Cheng, Tzy-Kuang Lee, Hao-Chun Liu, Po-Hao Tsai, Chih-Hsien Lin | 2024-07-30 |
| 12040289 | Interposer including a copper edge seal ring structure and methods of forming the same | Hong-Seng Shue, Ming-Da Cheng, Yao-Chun Chuang, Yu-Tse Su, Chen-Shien Chen | 2024-07-16 |
| 11990428 | Bonding structures in semiconductor packaged device and method of forming same | Hao-Chun Liu, Kuo-Ching Hsu, Mirng-Ji Lii | 2024-05-21 |
| 11961791 | Package structures and methods for forming the same | Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2024-04-16 |
| 11908790 | Chip structure with conductive via structure and method for forming the same | Ting-Li Yang, Po-Hao Tsai, Hong-Seng Shue, Yu-Tse Su | 2024-02-20 |
| 11901323 | Semiconductor packages having conductive pillars with inclined surfaces | Chiang-Jui Chu, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2024-02-13 |
| 11901256 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Chang-Jung Hsueh, Cheng-Nan Lin, Wan-Yu Chiang, Wei-Hung Lin, Ming-Da Cheng | 2024-02-13 |
| 11855045 | Semiconductor device with discrete blocks | Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu | 2023-12-26 |
| 11769741 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Ming-Da Cheng, Ching-Ho Cheng, Wei Sen Chang, Hong-Seng Shue +1 more | 2023-09-26 |
| 11742298 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2023-08-29 |
| 11688708 | Chip structure and method for forming the same | Shan-Yu Huang, Ming-Da Cheng, Hsiao-Wen Chung, LI-CHUN HUNG, Yuan-Yao Chang +1 more | 2023-06-27 |
| 11488878 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2022-11-01 |
| 11398444 | Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the same | Chiang-Jui Chu, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2022-07-26 |
| 11393771 | Bonding structures in semiconductor packaged device and method of forming same | Hao-Chun Liu, Kuo-Ching Hsu, Mirng-Ji Lii | 2022-07-19 |
| 11348884 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Ming-Da Cheng, Ching-Ho Cheng, Wei Sen Chang, Hong-Seng Shue +1 more | 2022-05-31 |
| 11342253 | Package structures and methods for forming the same | Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2022-05-24 |