Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334476 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Wei Sen Chang | 2025-06-17 |
| 12100674 | Embedded resistor-capacitor film for fan out wafer level packaging | Ernesto Gutierrez, III, Jesus Mennen Belonio, Jr. | 2024-09-24 |
| 11855045 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Wei Sen Chang | 2023-12-26 |
| 11387171 | Method of packaging a semiconductor die | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Shien Chen | 2022-07-12 |
| 11309255 | Very thin embedded trace substrate-system in package (SIP) | Jesus Mennen Belonio, Jr., Ian Kent, Ernesto Gutierrez, III, Melvin Martin, Rajesh Subraya Aiyandra | 2022-04-19 |
| 11251132 | Integrated type MIS substrate for thin double side SIP package | Chehan Jerry Li, Jesus Mennen Belonio, Jr. | 2022-02-15 |
| 11239185 | Embedded resistor-capacitor film for fan out wafer level packaging | Ernesto Gutierrez, III, Jesus Mennen Belonio, Jr. | 2022-02-01 |
| 11217562 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Wei Sen Chang | 2022-01-04 |
| 11114359 | Wafer level chip scale package structure | Jesus Mennen Belonio, Jr., Ian Kent, Ernesto Gutierrez, III, Jerry Li | 2021-09-07 |
| 11094669 | Wafer level molded PPGA (pad post grid array) for low cost package | Jesus Mennen Belonio, Jr. | 2021-08-17 |
| 10854577 | 3D die stacking structure with fine pitches | Chen-Hua Yu, Chen-Shien Chen | 2020-12-01 |
| 10727174 | Integrated circuit package and a method for forming a wafer level chip scale package (WLCSP) with through mold via (TMV) | Jesus Mennen Belonio, Jr., Ernesto Gutierrez, III, Jerry Li | 2020-07-28 |
| 10636742 | Very thin embedded trace substrate-system in package (SIP) | Jesus Mennen Belonio, Jr., Ian Kent, Ernesto Gutierrez, III, Melvin Martin, Rajesh Subraya Aiyandra | 2020-04-28 |
| 10629507 | System in package (SIP) | Che-Han Li, Jesus Mennen Belonio, Jr., Ernesto Gutierrez, III | 2020-04-21 |
| 10510727 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Wei Sen Chang | 2019-12-17 |
| 10008479 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Wei Sen Chang | 2018-06-26 |
| 9837289 | Methods for forming package-on-package structures having buffer dams | Ching-Wen Hsiao, Chen-Shien Chen | 2017-12-05 |
| 9543278 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Wei Sen Chang | 2017-01-10 |
| 9330947 | Methods for forming package-on-package structures having buffer dams | Ching-Wen Hsiao, Chen-Shien Chen | 2016-05-03 |
| 9293449 | Methods and apparatus for package on package devices with reversed stud bump through via interconnections | Chen-Shien Chen, Tin-Hao Kuo, Chih-Hua Chen, Ching-Wen Hsiao | 2016-03-22 |