Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334476 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Shou-Cheng Hu | 2025-06-17 |
| 12142582 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Chun-Hung Chen, Ching-Ho Cheng, Hsiao Ching-Wen, Hong-Seng Shue +1 more | 2024-11-12 |
| 11855045 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Shou-Cheng Hu | 2023-12-26 |
| 11769741 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Ming-Da Cheng, Ching-Ho Cheng, Hong-Seng Shue, Ching-Wen Hsiao +1 more | 2023-09-26 |
| 11476125 | Multi-die package with bridge layer | Yu-Feng Chen, Chen-Shien Chen, Mirng-Ji Lii | 2022-10-18 |
| 11348884 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Ming-Da Cheng, Ching-Ho Cheng, Hong-Seng Shue, Ching-Wen Hsiao +1 more | 2022-05-31 |
| 11217562 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Shou-Cheng Hu | 2022-01-04 |
| 11101192 | Wafer level embedded heat spreader | Tsung-Hsien Chiang, Yen-Chang Hu, Ching-Wen Hsiao | 2021-08-24 |
| 10978363 | Semiconductor structure with conductive structure | Pei-Chun Tsai, Tin-Hao Kuo, Hao-Yi Tsai | 2021-04-13 |
| 10978362 | Semiconductor structure with conductive structure | Pei-Chun Tsai, Tin-Hao Kuo, Hao-Yi Tsai | 2021-04-13 |
| 10861823 | Dual-sided integrated fan-out package | Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2020-12-08 |
| 10840111 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng +3 more | 2020-11-17 |
| 10643861 | Methods for making multi-die package with bridge layer | Yu-Feng Chen, Chen-Shien Chen, Mirng-Ji Lii | 2020-05-05 |
| 10510727 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Shou-Cheng Hu | 2019-12-17 |
| 10490468 | Semiconductor structure with conductive structure | Pei-Chun Tsai, Tin-Hao Kuo, Hao-Yi Tsai | 2019-11-26 |
| 10276509 | Integrated fan-out package | Chih-Hao Chang, Hsin-Hung Liao, Hao-Yi Tsai, Chien Ling Hwang, Tsung-Hsien Chiang +1 more | 2019-04-30 |
| 10177073 | Wafer level embedded heat spreader | Tsung-Hsien Chiang, Yen-Chang Hu, Ching-Wen Hsiao | 2019-01-08 |
| 10153249 | Dual-sided integrated fan-out package | Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2018-12-11 |
| 10008479 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Shou-Cheng Hu | 2018-06-26 |
| 9947552 | Structure and formation method of chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng +3 more | 2018-04-17 |
| 9935024 | Method for forming semiconductor structure | Pei-Chun Tsai, Tin-Hao Kuo, Hao-Yi Tsai | 2018-04-03 |
| 9899288 | Interconnect structures for wafer level package and methods of forming same | Chih-Hao Chang, Tsung-Hsien Chiang, Guan-Yu Chen, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2018-02-20 |
| 9870997 | Integrated fan-out package and method of fabricating the same | Chih-Hao Chang, Hsin-Hung Liao, Hao-Yi Tsai, Chien Ling Hwang, Tsung-Hsien Chiang +1 more | 2018-01-16 |
| 9735087 | Wafer level embedded heat spreader | Tsung-Hsien Chiang, Yen-Chang Hu, Ching-Wen Hsiao | 2017-08-15 |
| 9666530 | Semiconductor device | Chen-Shien Chen, Yu-Chih Huang, Yu-Feng Chen, Kuo Lung Pan, Yu-Jen Cheng +2 more | 2017-05-30 |