Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406764 | Method for determining ciliary beat frequency | Ren-Hao Xie, Shiue-Luen Chen | 2025-09-02 |
| 12400330 | Method of tracking movement of particles in bronchus | Ren-Hao Xie, Shiue-Luen Chen | 2025-08-26 |
| 12031923 | Microwave moisture content sensor and method for deriving linear regression correlation between moisture content of object and signal measured by moisture content sensor | Wei-Chen Cheng, Jwo-Shiun Sun, Bing-Chen Lu, Chu-Hsien Cheng | 2024-07-09 |
| 11956994 | OLED light field architectures | Chung-Chih Wu, Hoang-Yan Lin, Guo-Dong Su, Zih-Rou Cyue, Li-Yu Yu +7 more | 2024-04-09 |
| 11803080 | Polarizer module and operation method thereof | Syuan-Ling Yang, Chao-Wei Li | 2023-10-31 |
| 11795437 | Method for cultivating primary human pulmonary alveolar epithelial cells and application thereof | Jia-Wei Yang | 2023-10-24 |
| 11775726 | Integrated circuit having latch-up immunity | Ming-Fang Lai, Yi-Feng Chang | 2023-10-03 |
| 11732230 | Biomimetic system | Jia-Wei Yang, Ko-Chih Lin | 2023-08-22 |
| 11502032 | Chip package and method of fabricating the same | An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2022-11-15 |
| 11416666 | Integrated circuit and method for forming the same | Ming-Fang Lai, Yi-Feng Chang | 2022-08-16 |
| 11231613 | Display apparatus | Wei-Ming Cheng, Min-Hsuan Chiu | 2022-01-25 |
| 10872855 | Chip package and method of fabricating the same | An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2020-12-22 |
| 10630273 | Clock circuit having a pulse width adjustment module | Ming-Hui Tung, Li-Jun Gu, Bo-Yu Chen | 2020-04-21 |
| 10366971 | Pre-applying supporting materials between bonded package components | Yu-Chen Hsu, Yu-Feng Chen, Han-Ping Pu, Meng-Tse Chen | 2019-07-30 |
| 10170827 | Housing structure having conductive adhesive antenna and conductive adhesive antenna thereof | — | 2019-01-01 |
| 10141378 | Light emitting device free of TFT and chiplet | Yi-Ping Lin, Jung-Yu Li, Jin-Han Wu, Cheng-Hung Li, Shih-Pu Chen | 2018-11-27 |
| 10128195 | Substrate design with balanced metal and solder resist density | Yu-Wei Lin, Yu-Min Liang, Tin-Hao Kuo, Chen-Shien Chen | 2018-11-13 |
| 10090575 | Method of manufacturing a waveguide assembly by adhesively bonding two waveguide units and a waveguide structure formed therefrom | Pai-Lee CHANG | 2018-10-02 |
| 10043774 | Integrated circuit packaging substrate, semiconductor package, and manufacturing method | Yu-Wei Lin, Chen-Shien Chen, Tin-Hao Kuo, Yen-Liang Lin | 2018-08-07 |
| 9966346 | Bump structure and method of forming same | Yu-Wei Lin, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2018-05-08 |
| 9899288 | Interconnect structures for wafer level package and methods of forming same | Chih-Hao Chang, Tsung-Hsien Chiang, Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2018-02-20 |
| 9812405 | Semiconductor package and manufacturing method of the same | Yu-Wei Lin, Tin-Hao Kuo, Chen-Shien Chen | 2017-11-07 |
| 9741959 | Light emitting device | Yi-Ping Lin, Jung-Yu Li, Shih-Pu Chen, Jin-Han Wu, Cheng-Chang Chen | 2017-08-22 |
| 9704924 | Light emitting device | Yi-Ping Lin, Jung-Yu Li, Shih-Pu Chen, Jin-Han Wu, Cheng-Chang Chen | 2017-07-11 |
| 9673800 | Analog switch circuit applicable to high frequency signal | Leaf Chen | 2017-06-06 |