Issued Patents All Time
Showing 1–25 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431417 | Semiconductor package and method of manufacturing the same | An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin, Ming-Shih Yeh | 2025-09-30 |
| 12388047 | Integrated fan-out platform and manufacturing method for semiconductor devices | Hsueh-Lung Cheng, Yao-Chun Chuang, Yinlung Lu | 2025-08-12 |
| 12354946 | Delamination control of dielectric layers of integrated circuit chips | Jun He, Yao-Chun Chuang, Chih-Lin Wang, Shih-Kang Tien | 2025-07-08 |
| 12347749 | Semiconductor packages | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2025-07-01 |
| 12334465 | Semiconductor package and method of forming same | Yao-Chun Chuang, SyuFong Li, Ching-Pin Lin, Jun He | 2025-06-17 |
| 12327819 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2025-06-10 |
| 12322716 | Heat dissipating features for laser drilling process | Chien-Hung Chen, Cheng-Pu Chiu, Chien-Chen Li, Chien-Li Kuo, Ting-Ting Kuo +2 more | 2025-06-03 |
| 12243833 | Semiconductor device with electromagnetic interference film and method of manufacture | Chi-Hsi Wu, Hsien-Wei Chen, Tien-Chung Yang | 2025-03-04 |
| 12170207 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Der-Chyang Yeh | 2024-12-17 |
| 12159853 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, An-Jhih Su, Ming-Shih Yeh +1 more | 2024-12-03 |
| 12119320 | Chip package structure with bump | Wei-Yu Chen, An-Jhih Su, Hsien-Wei Chen | 2024-10-15 |
| 12087745 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Po-Hao Tsai +2 more | 2024-09-10 |
| 12062602 | Semiconductor package and method of manufacturing the same | An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin, Ming-Shih Yeh | 2024-08-13 |
| 11984422 | Semiconductor package and method of forming same | Yao-Chun Chuang, SyuFong Li, Ching-Pin Lin, Jun He | 2024-05-14 |
| 11984410 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Hua-Wei Tseng, Yu-Hsiang Hu | 2024-05-14 |
| 11929322 | Method of forming device and package structure | Hsien-Wei Chen, An-Jhih Su | 2024-03-12 |
| 11854994 | Redistribution structure for integrated circuit package and method of forming same | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2023-12-26 |
| 11837587 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Po-Hao Tsai +2 more | 2023-12-05 |
| 11823912 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Der-Chyang Yeh | 2023-11-21 |
| 11756931 | Chip package structure with molding layer | Wei-Yu Chen, An-Jhih Su, Hsien-Wei Chen | 2023-09-12 |
| 11742298 | Alignment mark design for packages | Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2023-08-29 |
| 11728249 | Semiconductor package and method | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2023-08-15 |
| 11721676 | Package structure with dummy die | Hsien-Wei Chen | 2023-08-08 |
| 11682654 | Semiconductor structure having a sensor device and method of manufacturing the same | Der-Chyang Yeh, Ta-Hsuan Lin, Ming-Shih Yeh | 2023-06-20 |
| 11682637 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Hua-Wei Tseng, Yu-Hsiang Hu | 2023-06-20 |