Issued Patents All Time
Showing 25 most recent of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424573 | Passivation scheme for pad openings and trenches | Ming-Hong Chang, Chun-Yi Yang, Kun-Ming Huang, Po-Tao Chu, Shen-Ping Wang | 2025-09-23 |
| 12322716 | Heat dissipating features for laser drilling process | Chien-Hung Chen, Cheng-Pu Chiu, Chien-Chen Li, Ting-Ting Kuo, Li-Hsien Huang +2 more | 2025-06-03 |
| 12288794 | Image sensor and manufacturing method thereof | Chung-Lei Chen, Clark Lee, Wen-Sheng Wang | 2025-04-29 |
| 12272725 | Low warpage high density trench capacitor | Jyun-Ying Lin, Hsin-Li Cheng, Jing-Hwang Yang, Felix Ying-Kit Tsui | 2025-04-08 |
| 12218159 | Image sensor and manufacturing method thereof | Chung-Lei Chen, Clark Lee, Wen-Sheng Wang | 2025-02-04 |
| 12119237 | Semiconductor device package having metal thermal interface material | Chin-Fu Kao, Chen-Shien Chen | 2024-10-15 |
| 12100754 | Semiconductor arrangement and method of making | Chi-Fu Lin, Cheng-Hsin Chen, Ming-I Hsu, Kun-Ming Huang | 2024-09-24 |
| 12027603 | Semiconductor device | Jheng-Sheng YOU, Hsin-Chih Lin, Kun-Ming Huang, Lieh-Chuan Chen, Po-Tao Chu +1 more | 2024-07-02 |
| 12002774 | Passivation scheme for pad openings and trenches | Ming-Hong Chang, Chun-Yi Yang, Kun-Ming Huang, Po-Tao Chu, Shen-Ping Wang | 2024-06-04 |
| 11901433 | Semiconductor device | Jheng-Sheng YOU, Hsin-Chih Lin, Kun-Ming Huang, Lieh-Chuan Chen, Po-Tao Chu +1 more | 2024-02-13 |
| 11742218 | Semiconductor device package having metal thermal interface material and method for forming the same | Chin-Fu Kao, Chen-Shien Chen | 2023-08-29 |
| 11688762 | Low warpage high density trench capacitor | Jyun-Ying Lin, Hsin-Li Cheng, Jing-Hwang Yang, Felix Ying-Kit Tsui | 2023-06-27 |
| 11664398 | Image sensor and manufacturing method thereof | Chung-Lei Chen, Clark Lee, Wen-Sheng Wang | 2023-05-30 |
| 11621235 | Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging | Kuen-Shian Chen | 2023-04-04 |
| 11515398 | Thin poly field plate design | Scott Liu, Po-Wei Chen, Shih-Hsiang Tai | 2022-11-29 |
| 11444046 | Passivation scheme for pad openings and trenches | Ming-Hong Chang, Chun-Yi Yang, Kun-Ming Huang, Po-Tao Chu, Shen-Ping Wang | 2022-09-13 |
| 11374107 | Semiconductor device | Jheng-Sheng YOU, Hsin-Chih Lin, Kun-Ming Huang, Lieh-Chuan Chen, Po-Tao Chu +1 more | 2022-06-28 |
| 11114543 | Group III-V device structure | Ming-Hong Chang, Chih-Yuan Chan, Shen-Ping Wang, Chung-Cheng Chen, Po-Tao Chu | 2021-09-07 |
| 11069630 | Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging | Kuen-Shian Chen | 2021-07-20 |
| 10868110 | Low warpage high density trench capacitor | Jyun-Ying Lin, Hsin-Li Cheng, Jing-Hwang Yang, Felix Ying-Kit Tsui | 2020-12-15 |
| 10861832 | Package structure and method of manufacturing the same | — | 2020-12-08 |
| 10825905 | Thin poly field plate design | Scott Liu, Po-Wei Chen, Shih-Hsiang Tai | 2020-11-03 |
| 10804231 | Passivation scheme for pad openings and trenches | Ming-Hong Chang, Chun-Yi Yang, Kun-Ming Huang, Po-Tao Chu, Shen-Ping Wang | 2020-10-13 |
| 10714452 | Package structure and method of manufacturing the same | — | 2020-07-14 |
| 10686054 | Semiconductor device | Jheng-Sheng YOU, Hsin-Chih Lin, Kun-Ming Huang, Lieh-Chuan Chen, Po-Tao Chu +1 more | 2020-06-16 |