Issued Patents All Time
Showing 1–25 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424558 | Bridge die having different surface orientation than IC dies interconnected by the bridge die | Yu-Sheng Lin, Tsung-Yang Hsieh, Jyun-Lin Wu, Yao-Chun Chuang | 2025-09-23 |
| 12300574 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan | 2025-05-13 |
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2025-05-06 |
| 12293951 | Semiconductor package structure having ring portion with recess for adhesive | Hui-Ting Lin, Chen-Shien Chen | 2025-05-06 |
| 12272663 | Metal-bump sidewall protection | Jung-Hua Chang, Jian-Yang He | 2025-04-08 |
| 12230609 | Semiconductor packages | Chih-Yuan Chien, Li-Hui Cheng, Szu-Wei Lu | 2025-02-18 |
| 12218117 | Method of forming package structure and package structure therefrom | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2025-02-04 |
| 12176261 | Method of fabricating package structure | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu | 2024-12-24 |
| 12170236 | Method for forming package structure | Chih-Hao Chen, Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2024-12-17 |
| 12131974 | Semiconductor package and method of manufacturing semiconductor package | Chen-Shien Chen | 2024-10-29 |
| 12119237 | Semiconductor device package having metal thermal interface material | Chien-Li Kuo, Chen-Shien Chen | 2024-10-15 |
| 12068218 | Package structures | Pu Wang, Szu-Wei Lu | 2024-08-20 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2024-06-18 |
| 11978720 | Semiconductor device package and methods of manufacture | Kai Jun Zhan, Kuang-Chun Lee, Ming-Da Cheng, Chen-Shien Chen | 2024-05-07 |
| 11942403 | Integrated circuit package and method | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2024-03-26 |
| 11901255 | Semiconductor device and method of forming the same | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2024-02-13 |
| 11894287 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan | 2024-02-06 |
| 11855060 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Pu Wang, Szu-Wei Lu | 2023-12-26 |
| 11855054 | Method of forming package structure | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2023-12-26 |
| 11764168 | Chip package structure with anchor structure and method for forming the same | Hui-Ting Lin, Chen-Shien Chen | 2023-09-19 |
| 11756855 | Method of fabricating package structure | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu | 2023-09-12 |
| 11749575 | Semiconductor package structure having ring portion with recess for adhesive and method for forming the same | Hui-Ting Lin, Chen-Shien Chen | 2023-09-05 |
| 11742218 | Semiconductor device package having metal thermal interface material and method for forming the same | Chien-Li Kuo, Chen-Shien Chen | 2023-08-29 |
| 11664286 | Method for forming package structure | Chih-Hao Chen, Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2023-05-30 |
| 11626344 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan | 2023-04-11 |