Issued Patents All Time
Showing 1–25 of 111 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424587 | Semiconductor device having underfill surrounding bottom package and solder ball | Jing-Cheng Lin, Ying-Ching Shih, Chen-Hua Yu | 2025-09-23 |
| 12420800 | System and method for tracking an expanded state of a moving object using an online adapted compound measurement model | Gang Yao, Karl Berntorp, Hassan Mansour, Petros Boufounos, Philip Orlik | 2025-09-23 |
| 12412802 | Heat dissipation structures for integrated circuit packages and methods of forming the same | Chih-Hao Chen, Po-Yuan Cheng, Li-Hui Cheng | 2025-09-09 |
| 12372609 | Frequency modulation continuous wave (FMCW)-based system for estimation and compensation of nonlinearity in linearly swept sources | David Millar, Kieran Parsons, Philip Orlik | 2025-07-29 |
| 12368084 | Package structure and manufacturing method thereof | Chih-Hao Chen, Po-Yuan Cheng, Li-Hui Cheng, Szu-Wei Lu | 2025-07-22 |
| 12362245 | Package assembly including a package lid having an inner foot and methods of making the same | Tsung-Fu Tsai, Ying-Ching Shih, Szu-Wei Lu | 2025-07-15 |
| 12343110 | Multi-modal imaging device | Shuhua YUE, Xun Chen | 2025-07-01 |
| 12339410 | Determining shear slowness from dipole source-based measurements acquired by a logging while drilling acoustic measurement tool | Sandip Bose, Bikash K. Sinha | 2025-06-24 |
| 12278162 | Coplanar control for film-type thermal interface | Yu-Hsun Wang, Ping-Yin Hsieh, Li-Hui Cheng, Szu-Wei Lu | 2025-04-15 |
| 12266633 | Semiconductor structure and method of forming the same | Chih-Chien Pan, Li-Hui Cheng, An-Jhih Su, Szu-Wei Lu | 2025-04-01 |
| 12248054 | System and method for detecting an object in a scene | Sian Jin, Petros Boufounos, Philip Orlik | 2025-03-11 |
| 12224224 | Package structure with metallic layer over the surfaces of a plurality of semiconductor dies | Chih-Hao Chen, Po-Yuan Cheng, Li-Hui Cheng | 2025-02-11 |
| 12210114 | System and method for mutual interference mitigation of FMCW automotive radar | Sian Jin | 2025-01-28 |
| 12211818 | Manufacturing method of semiconductor package using jig | Chih-Hao Chen, Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2025-01-28 |
| 12213177 | Suspendable CSMA/CA for IEEE 802.15.4 system to reduce packet discard caused by backoff failure | Jianlin Guo, Yukimasa Nagai, Takenori Sumi, Kieran Parsons, Philip Orlik | 2025-01-28 |
| 12196679 | High throughput snapshot spectral encoding device for fluorescence spectral microscopy | Francesco Cutrale, Scott E. Fraser | 2025-01-14 |
| 12154194 | Coherent optical sensor with sparse illumination | David Millar, Okan Atalar, Keisuke Kojima, Toshiaki Koike-Akino, Kieran Parsons | 2024-11-26 |
| 12132004 | Semiconductor devices and methods of manufacture | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu | 2024-10-29 |
| 12105185 | System and method for radar object recognition with cross-frame temporal relationality | Peizhao Li, Karl Berntorp | 2024-10-01 |
| 12100640 | High efficiency heat dissipation using thermal interface material film | Chih-Hao Chen, Hung-Yu Chen, Li-Hui Cheng, Szu-Wei Lu | 2024-09-24 |
| 12068218 | Package structures | Chin-Fu Kao, Szu-Wei Lu | 2024-08-20 |
| 12063707 | Active cross-technology neighbor discovery | Jianlin Guo, Shuai Wang, Kieran Parsons, Philip Orlik, Yukimasa Nagai +1 more | 2024-08-13 |
| 12063620 | Bluetooth-based spatial-temporal localization | Jianyuan Yu, Toshiaki Koike-Akino, Philip Orlik | 2024-08-13 |
| 12033912 | Package structure and manufacturing method thereof | Ping-Yin Hsieh, Li-Hui Cheng, Szu-Wei Lu | 2024-07-09 |
| 11996345 | Package structure and manufacturing method thereof | Chih-Hao Chen, Po-Yuan Cheng, Li-Hui Cheng, Szu-Wei Lu | 2024-05-28 |