Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412802 | Heat dissipation structures for integrated circuit packages and methods of forming the same | Chih-Hao Chen, Pu Wang, Li-Hui Cheng | 2025-09-09 |
| 12368084 | Package structure and manufacturing method thereof | Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2025-07-22 |
| 12224224 | Package structure with metallic layer over the surfaces of a plurality of semiconductor dies | Chih-Hao Chen, Pu Wang, Li-Hui Cheng | 2025-02-11 |
| 11996345 | Package structure and manufacturing method thereof | Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2024-05-28 |
| 11869822 | Semiconductor package and manufacturing method thereof | Chih-Hao Chen, Pu Wang, Li-Hui Cheng | 2024-01-09 |
| 11065724 | Laser weldable compositions, products and uses thereof | Te-Shun Lin, Cheng-Hsiang Hung, Hsin-Hsien Tsai, Yung-Sheng Lin, Kuen-Yuan Hwang +1 more | 2021-07-20 |
| 8663599 | Pharmaceutical composition of nanoparticles | Hsing-Wen Sung, Zi-Xian Liao, Min-Fan Chung, Ko-Jie Chen, Hosheng Tu | 2014-03-04 |
| 7223157 | Chemical-mechanical polishing apparatus and method of conditioning polishing pad | Sheng-Yu Chen, Te-Sung Hung, Chung-Jun Cheng, Chi-Piao Cheng | 2007-05-29 |