Issued Patents All Time
Showing 1–25 of 292 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424576 | Integrated circuit package and method | Wen-Chih Chiou, Chen-Hua Yu, Shih-Ting Lin | 2025-09-23 |
| 12412841 | Semiconductor package and manufacturing method thereof | Chen-Hsuan Tsai, Chin-Chuan Chang, Tsung-Fu Tsai | 2025-09-09 |
| 12411279 | Integrated circuit package and method of forming same | Chen-Hua Yu, Jiun Yi Wu | 2025-09-09 |
| 12400878 | Integrated circuit package and method | Shih-Ting Lin, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu, Weiming Chris Chen | 2025-08-26 |
| 12387997 | Semiconductor packages | Yi-Jung Chen, Wei-An Tsao, Tsung-Fu Tsai | 2025-08-12 |
| 12381177 | Package structure and method of fabricating the same | Kung-Chen Yeh, Tsung-Fu Tsai, Ying-Ching Shih | 2025-08-05 |
| 12368128 | Device bonding apparatus and method of manufacturing a package using the apparatus | Yi-Jung Chen, Tsung-Fu Tsai | 2025-07-22 |
| 12368084 | Package structure and manufacturing method thereof | Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Li-Hui Cheng | 2025-07-22 |
| 12368123 | Package structure including stacked pillar portions and method for fabricating the same | Jung-Hua Chang, Ying-Ching Shih | 2025-07-22 |
| 12362245 | Package assembly including a package lid having an inner foot and methods of making the same | Tsung-Fu Tsai, Pu Wang, Ying-Ching Shih | 2025-07-15 |
| 12353011 | Photonic package and method of manufacture | Tsung-Fu Tsai, Hsing-Kuo Hsia, Chen-Hua Yu | 2025-07-08 |
| 12347708 | Inspection apparatus, manufacturing method of integrated circuit, and inspection method | Tsung-Fu Tsai | 2025-07-01 |
| 12315806 | Electronic device and manufacturing method thereof | Tsung-Fu Tsai, Hou-Ju Huang, Shih-Ting Lin, Hung-Wei Tsai | 2025-05-27 |
| 12300574 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Chih-Chien Pan | 2025-05-13 |
| 12278162 | Coplanar control for film-type thermal interface | Yu-Hsun Wang, Ping-Yin Hsieh, Pu Wang, Li-Hui Cheng | 2025-04-15 |
| 12272568 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh +1 more | 2025-04-08 |
| 12266633 | Semiconductor structure and method of forming the same | Chih-Chien Pan, Pu Wang, Li-Hui Cheng, An-Jhih Su | 2025-04-01 |
| 12255079 | Semiconductor package and method of manufacturing the same | Chin-Chuan Chang, Chen-Hua Yu | 2025-03-18 |
| 12255155 | Package structure with stacked semiconductor dies | Yi-Chao Mao, Chin-Chuan Chang | 2025-03-18 |
| 12237238 | Package structure and method | Jing-Cheng Lin, Chen-Hua Yu | 2025-02-25 |
| 12230609 | Semiconductor packages | Chin-Fu Kao, Chih-Yuan Chien, Li-Hui Cheng | 2025-02-18 |
| 12230605 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Chih-Wei Wu | 2025-02-18 |
| 12218117 | Method of forming package structure and package structure therefrom | Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng | 2025-02-04 |
| 12211818 | Manufacturing method of semiconductor package using jig | Chih-Hao Chen, Chih-Chien Pan, Pu Wang, Li-Hui Cheng | 2025-01-28 |
| 12176261 | Method of fabricating package structure | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng | 2024-12-24 |