Issued Patents All Time
Showing 1–25 of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422635 | Thermo-electric cooler for dissipating heat of optical engine | Chih-Kuang Yu, Chen-Hua Yu, Jui Lin Chao | 2025-09-23 |
| 12392961 | Structure and process for photonic packages | Chen-Hua Yu, Kuo-Chiang Ting | 2025-08-19 |
| 12379556 | Package structure having grating coupler and manufacturing method thereof | Feng-Wei Kuo, Chewn-Pu Jou, Chih-Wei Tseng | 2025-08-05 |
| 12368146 | Hybrid integrated circuit packages | Chen-Hua Yu, Jiun Yi Wu | 2025-07-22 |
| 12353011 | Photonic package and method of manufacture | Tsung-Fu Tsai, Szu-Wei Lu, Chen-Hua Yu | 2025-07-08 |
| 12306036 | Optical devices and methods of manufacture | Hua-Kung Chiu, JIA-HONG WU, Chen-Hua Yu | 2025-05-20 |
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2025-05-06 |
| 12259578 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Kuo-Chiang Ting, Shang-Yun Hou | 2025-03-25 |
| 12253729 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Sung-Hui Huang, Kuan-Yu Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2025-03-18 |
| 12242108 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Kuo-Chiang Ting, Sung-Hui Huang, Shang-Yun Hou, Chi-Hsi Wu | 2025-03-04 |
| 12135454 | Structure and process for photonic packages | Chen-Hua Yu, Kuo-Chiang Ting | 2024-11-05 |
| 12092861 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu | 2024-09-17 |
| 12068297 | Hybrid integrated circuit package | Chen-Hua Yu, Jiun Yi Wu | 2024-08-20 |
| 12066671 | Semiconductor devices with vertically stacked and laterally offset intermediate waveguides | Cheng-Tse Tang, Chewn-Pu Jou, Chih-Wei Tseng, Ming Yang Chung | 2024-08-20 |
| 12044892 | Package structure including photonic package and interposer having waveguide | Chen-Hua Yu | 2024-07-23 |
| 12038599 | Photonic package and method of manufacture | Chen-Hua Yu, Kuo-Chiang Ting, Jiun Yi Wu, Hung-Yi Kuo, Shang-Yun Hou | 2024-07-16 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2024-06-18 |
| 12007611 | Package structure having grating coupler and manufacturing method thereof | Feng-Wei Kuo, Chewn-Pu Jou, Chih-Wei Tseng | 2024-06-11 |
| 11973074 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu | 2024-04-30 |
| 11960122 | Devices, systems, and methods for optical signal processing | Feng-Wei Kuo, Chewn-Pu Jou | 2024-04-16 |
| 11953725 | Grating coupler and method of manufacturing the same | Feng-Wei Kuo, Chewn-Pu Jou | 2024-04-09 |
| 11852868 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Kuo-Chiang Ting, Sung-Hui Huang, Shang-Yun Hou, Chi-Hsi Wu | 2023-12-26 |
| 11830864 | Photonic semiconductor device and method | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang, Chen-Hua Yu | 2023-11-28 |
| 11830841 | Semiconductor package and method for manufacturing the same | Chuei-Tang Wang, Chih-Chieh Chang, Yu-Kuang Liao, Chih-Yuan Chang, Jeng-Shien Hsieh +1 more | 2023-11-28 |
| 11796735 | Integrated 3DIC with stacked photonic dies and method forming same | Chen-Hua Yu | 2023-10-24 |