Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422635 | Thermo-electric cooler for dissipating heat of optical engine | Hsing-Kuo Hsia, Chen-Hua Yu, Jui Lin Chao | 2025-09-23 |
| 9502627 | Wafer level photonic devices dies structure and method of making the same | Hung-Yi Kuo | 2016-11-22 |
| 9472714 | Dicing-free LED fabrication | Hsing-Kuo Hsia, Gordon Kuo | 2016-10-18 |
| 9379299 | LED device with improved thermal performance | Hsing-Kuo Hsia, Hung-Yi Kuo, Chyi Shyuan Chern | 2016-06-28 |
| 9349712 | Doubled substrate multi-junction light emitting diode array structure | Chyi Shyuan Chern | 2016-05-24 |
| 9287478 | Method and apparatus for accurate die-to-wafer bonding | Chyi Shyuan Chern, Hsin-Hsien Wu, Hung-Yi Kuo | 2016-03-15 |
| 9224932 | Wafer level photonic device die structure and method of making the same | Hung-Yi Kuo | 2015-12-29 |
| 9184334 | LED structure | Shouli Steve Hsia, Ken Wen-Chien Fu, Hung-Yi Kuo, Hung-Chao Kao, Ming-Feng Wu +1 more | 2015-11-10 |
| 9099632 | Light emitting diode emitter substrate with highly reflective metal bonding | Chyi Shyuan Chern, Wen-Chien Fu, Hsing-Kuo Hsia, Ching-Hua Chiu, Hung-Yi Kuo | 2015-08-04 |
| 8993447 | LED device with improved thermal performance | Hsing-Kuo Hsia, Hung-Yi Kuo, Chyi Shyuan Chern | 2015-03-31 |
| 8962358 | Double substrate multi-junction light emitting diode array structure | Chyi Shyuan Chern | 2015-02-24 |
| 8912033 | Dicing-free LED fabrication | Hsing-Kuo Hsia, Gordon Kuo | 2014-12-16 |
| 8809899 | LED structure | Shouli Steve Hsia, Ken Wen-Chien Fu, Hung-Yi Kuo, Hung-Chao Kao, Ming-Feng Wu +1 more | 2014-08-19 |
| 8722436 | Method and apparatus for accurate die-to-wafer bonding | Chyi Shyuan Chern, Hsin-Hsien Wu, Hung-Yi Kuo | 2014-05-13 |
| 8653542 | Micro-interconnects for light-emitting diodes | Hsing-Kuo Hsia | 2014-02-18 |
| 8609446 | Method and apparatus for accurate die-to-wafer bonding | Chyi Shyuan Chern, Hsin-Hsien Wu, Hung-Yi Kuo | 2013-12-17 |
| 8604491 | Wafer level photonic device die structure and method of making the same | Hung-Yi Kuo | 2013-12-10 |
| 8598617 | Methods of fabricating light emitting diode packages | Chyi Shyuan Chern, Hsing-Kuo Hsia, Hung-Yi Kuo | 2013-12-03 |
| 8587018 | LED structure having embedded zener diode | Shouli Steve Hsia, Ken Wen-Chien Fu, Hung-Yi Kuo, Hung-Chao Kao, Ming-Feng Wu +1 more | 2013-11-19 |
| 8546924 | Package structures for integrating thermoelectric components with stacking chips | Chun-Kai Liu, Ra-Min Tain | 2013-10-01 |
| 8519538 | Laser etch via formation | Hsing-Kuo Hsia, Ching-Hua Chiu, Troy Wu | 2013-08-27 |
| 8519409 | Light emitting diode components integrated with thermoelectric devices | Hsing-Kuo Hsia | 2013-08-27 |
| 8415684 | LED device with improved thermal performance | Hsing-Kuo Hsia, Gordon Kuo, Chyi Shyuan Chern | 2013-04-09 |
| 8415183 | Wafer level conformal coating for LED devices | Hsing-Kuo Hsia, Hung-Yi Kuo, Hung-Wen Huang | 2013-04-09 |
| 8242372 | Thermally conductive, electrically insulating composite film and stack chip package structure utilizing the same | Ming-Sheng Leu, Chun-Kai Liu, Jenn-Dong Hwang, Jin-Bao Wu | 2012-08-14 |