Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8241932 | Methods of fabricating light emitting diode packages | Chyi Shyuan Chern, Hsing-Kuo Hsia, Hung-Yi Kuo | 2012-08-14 |
| 8236584 | Method of forming a light emitting diode emitter substrate with highly reflective metal bonding | Chyi Shyuan Chem, Wen-Chien Fu, Hsing-Kuo Hsia, Ching-Hua Chiu, Hung-Yi Kuo | 2012-08-07 |
| 8222728 | Active solid heatsink device and fabricating method thereof | Chun-Kai Liu, Ming-Ji Dai, Chih-Yuan Cheng | 2012-07-17 |
| 8193625 | Stacked-chip packaging structure and fabrication method thereof | Chun-Kai Liu, Ming-Ji Dai, Ming-Che Hsieh | 2012-06-05 |
| 8188360 | Thermoelectric conversion device | Suh-Yun Feng, Chun-Kai Liu, Ming-Che Hsieh | 2012-05-29 |
| 8075182 | Apparatus and method for measuring characteristic and chip temperature of LED | Ming-Ji Dai, Chun-Kai Liu, Heng-Chieh Chien, Sheng-Liang Li | 2011-12-13 |
| 8008573 | Integrated package structure having solar cell and thermoelectric element and method of fabricating the same | Ming-Ji Dai, Chun-Kai Liu, Cheng-Ta Ko, Tsung-Chieh Cheng | 2011-08-30 |
| 7999172 | Flexible thermoelectric device | Chun-Kai Liu, Ming-Ji Dai | 2011-08-16 |
| 7972877 | Fabricating method of light emitting diode package | Ming-Ji Dai, Chun-Kai Liu | 2011-07-05 |
| 7855396 | Light emitting diode package structure | Ming-Ji Dai, Chun-Kai Liu | 2010-12-21 |
| 7633154 | Encapsulation and methods thereof | Ming-Ji Dai, Chun-Kai Liu, Shih-Hsien Wu | 2009-12-15 |
| 7586125 | Light emitting diode package structure and fabricating method thereof | Ming-Ji Dai, Chun-Kai Liu | 2009-09-08 |
| 7517114 | Lighting devices | Ra-Min Tain, Shyi-Ching Liau, Chun-Kai Liu, Ming-Ji Dai, Wei Han | 2009-04-14 |