Issued Patents All Time
Showing 1–25 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347912 | Multi-layered resonator circuit structure and multi-layered filter circuit structure | Chi-Feng Chen, Po-Sheng Yen, Ruey-Beei Wu, Chin-Sheng Wang, Jun Chen | 2025-07-01 |
| 12309943 | Circuit carrier and manufacturing method thereof and package structure | John Hon-Shing Lau, Cheng-Ta Ko, Tzyy-Jang Tseng, Chun-Hsien Chien | 2025-05-20 |
| 12200861 | Circuit board structure | Guang-Hwa Ma, Chin-Sheng Wang | 2025-01-14 |
| 11808787 | Probe card testing device | Tzyy-Jang Tseng, John Hon-Shing Lau, Kuo Ching Tien | 2023-11-07 |
| 11690173 | Circuit board structure | Tzyy-Jang Tseng, Chin-Sheng Wang | 2023-06-27 |
| 11678441 | Manufacturing method of circuit carrier board structure | Wei-Ti Lin, Chun-Hsien Chien, Chien-Chou Chen, Fu-Yang Chen | 2023-06-13 |
| 11641720 | Circuit board and manufacturing method thereof | Pei-Wei Wang, Shao-Chien Lee, Chi-Chun Po, Po-Hsiang Wang, Pei-Chang Huang +1 more | 2023-05-02 |
| 11631626 | Package structure | Po-Hsiang Wang, Chi-Chun Po | 2023-04-18 |
| 11545412 | Package structure and manufacturing method thereof | Pei-Wei Wang, Ching-Sheng Chen, Ming-Hao Wu, Hsuan-Wei Chen | 2023-01-03 |
| 11540396 | Circuit board structure and manufacturing method thereof | Tzyy-Jang Tseng, Shao-Chien Lee, John Hon-Shing Lau, Chen-Hua Cheng | 2022-12-27 |
| 11410971 | Chip package structure | Tzyy-Jang Tseng, Pu-Ju Lin, Cheng-Ta Ko | 2022-08-09 |
| 11410940 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng | 2022-08-09 |
| 11410933 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Tzyy-Jang Tseng, Kai-Ming Yang | 2022-08-09 |
| 11373927 | Package substrate and manufacturing method having a mesh gas-permeable structure disposed in the through hole | Chin-Sheng Wang, Pei-Chang Huang | 2022-06-28 |
| 11362057 | Chip package structure and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Tzyy-Jang Tseng | 2022-06-14 |
| 11337303 | Circuit board structure | Chi-Chun Po, Po-Hsiang Wang | 2022-05-17 |
| 11127664 | Circuit board and manufacturing method thereof | Kai-Ming Yang, Wang-Hsiang Tsai, Tzyy-Jang Tseng | 2021-09-21 |
| 11013103 | Method for forming circuit board stacked structure | Kai-Ming Yang, Chien-Tsai Li | 2021-05-18 |
| 10957658 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng | 2021-03-23 |
| 10888001 | Circuit carrier board structure and manufacturing method thereof | Wei-Ti Lin, Chun-Hsien Chien, Chien-Chou Chen, Fu-Yang Chen | 2021-01-05 |
| 10881006 | Package carrier and package structure | Pei-Chang Huang, Chi-Chun Po, Chun-Lin Liao, Po-Hsiang Wang, Hsuan-Wei Chen | 2020-12-29 |
| 10797017 | Embedded chip package, manufacturing method thereof, and package-on-package structure | Po-Chen Lin, Chun-Hsien Chien, Chien-Chou Chen | 2020-10-06 |
| 10714448 | Chip module with porous bonding layer and stacked structure with porous bonding layer | Chin-Sheng Wang | 2020-07-14 |
| 10685922 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng | 2020-06-16 |
| 10515870 | Package carrier having a mesh gas-permeable structure disposed in the through hole | Chin-Sheng Wang, Pei-Chang Huang | 2019-12-24 |