Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347912 | Multi-layered resonator circuit structure and multi-layered filter circuit structure | Chi-Feng Chen, Po-Sheng Yen, Ruey-Beei Wu, Ra-Min Tain, Jun Chen | 2025-07-01 |
| 12200861 | Circuit board structure | Guang-Hwa Ma, Ra-Min Tain | 2025-01-14 |
| 11943877 | Circuit board structure and manufacturing method thereof | Wen-Yu Lin, Kai-Ming Yang, Chen-Hao Lin, Pu-Ju Lin, Cheng-Ta Ko +2 more | 2024-03-26 |
| 11715715 | Metal bump structure and manufacturing method thereof and driving substrate | Tzyy-Jang Tseng, Ming-Ru Chen, Cheng-Chung Lo, Wen-Sen Tang | 2023-08-01 |
| 11690173 | Circuit board structure | Tzyy-Jang Tseng, Ra-Min Tain | 2023-06-27 |
| 11445596 | Circuit board having heat-dissipation block and method of manufacturing the same | Pei-Chang Huang | 2022-09-13 |
| 11373927 | Package substrate and manufacturing method having a mesh gas-permeable structure disposed in the through hole | Ra-Min Tain, Pei-Chang Huang | 2022-06-28 |
| 10714448 | Chip module with porous bonding layer and stacked structure with porous bonding layer | Ra-Min Tain | 2020-07-14 |
| 10515870 | Package carrier having a mesh gas-permeable structure disposed in the through hole | Pei-Chang Huang, Ra-Min Tain | 2019-12-24 |
| 10319610 | Package carrier | Shih-Hao Sun | 2019-06-11 |
| 10177067 | Manufacturing method of package carrier | Chih-Hsien Cheng, Shih-Hao Sun | 2019-01-08 |
| 9870931 | Package carrier and manufacturing method thereof | Shih-Hao Sun | 2018-01-16 |
| 9591753 | Circuit board and manufacturing method thereof | Ching-Sheng Chen, Mei Chang, Ching-Ta Chen | 2017-03-07 |
| 9458540 | Package substrate and manufacturing method thereof | Chien-Ming Chen | 2016-10-04 |
| 9433099 | Package carrier | Ching-Sheng Chen, Chao Wang | 2016-08-30 |
| 9282643 | Core substrate and method for fabricating circuit board | Chao Wang | 2016-03-08 |
| 9204546 | Circuit board and manufacturing method thereof | Ching-Sheng Chen, Chun-Kai Lin, Chao Wang | 2015-12-01 |
| 9008736 | Protective frame for mobile communication device | Li Hu, Yu-Chun Lu | 2015-04-14 |
| D722952 | Detachable smartphone protective device with backup power unit | Li Hu, Yu-Chun Lu, Shih-Chin Huang, Chun-Wei Tseng | 2015-02-24 |
| 8859908 | Package carrier | Chien-Ming Chen | 2014-10-14 |
| D712385 | Mobile phone protecting case | Li Hu, Yu-Chun Lu | 2014-09-02 |
| 8634887 | Protective frame for mobile communication device | Li Hu, Yu-Chun Lu | 2014-01-21 |
| 8563363 | Fabricating method of semiconductor package structure | Tzyy-Jang Tseng, Chih-Hong Chuang | 2013-10-22 |
| 8390013 | Semiconductor package structure and fabricating method of semiconductor package structure | Tzyy-Jang Tseng, Chih-Hong Chuang | 2013-03-05 |