Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11991824 | Circuit board structure and manufacturing method thereof | Tzyy-Jang Tseng, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Shao-Chien Lee +1 more | 2024-05-21 |
| 11923350 | Light emitting diode package structure | Ming-Ru Chen, Tzyy-Jang Tseng | 2024-03-05 |
| 11837591 | Manufacturing method of light emitting diode package structure | Ming-Ru Chen, Tzyy-Jang Tseng | 2023-12-05 |
| 11715715 | Metal bump structure and manufacturing method thereof and driving substrate | Tzyy-Jang Tseng, Ming-Ru Chen, Chin-Sheng Wang, Wen-Sen Tang | 2023-08-01 |
| 11335670 | Light emitting diode package structure and manufacturing method thereof | Ming-Ru Chen, Tzyy-Jang Tseng | 2022-05-17 |
| 10070536 | Manufacturing method of circuit board structure | Chien-Tsai Li, Chien-Te Wu | 2018-09-04 |
| 9917046 | Manufacturing method of a circuit board having a glass film | Chien-Te Wu, Chien-Tsai Li | 2018-03-13 |