Issued Patents All Time
Showing 1–25 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412879 | Package structure and manufacturing method thereof | John Hon-Shing Lau | 2025-09-09 |
| 12414243 | Manufacturing method of package structure | Kai-Ming Yang, Chen-Hao Lin, Cheng-Ta Ko, John Hon-Shing Lau, Yu-Hua Chen | 2025-09-09 |
| 12309943 | Circuit carrier and manufacturing method thereof and package structure | John Hon-Shing Lau, Ra-Min Tain, Cheng-Ta Ko, Chun-Hsien Chien | 2025-05-20 |
| 12243838 | Circuit substrate structure and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, John Hon-Shing Lau | 2025-03-04 |
| 11991824 | Circuit board structure and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Shao-Chien Lee, Ming-Ru Chen +1 more | 2024-05-21 |
| 11943877 | Circuit board structure and manufacturing method thereof | Wen-Yu Lin, Kai-Ming Yang, Chen-Hao Lin, Pu-Ju Lin, Cheng-Ta Ko +2 more | 2024-03-26 |
| 11923350 | Light emitting diode package structure | Ming-Ru Chen, Cheng-Chung Lo | 2024-03-05 |
| 11860428 | Package structure and optical signal transmitter | John Hon-Shing Lau | 2024-01-02 |
| 11837591 | Manufacturing method of light emitting diode package structure | Ming-Ru Chen, Cheng-Chung Lo | 2023-12-05 |
| 11808787 | Probe card testing device | John Hon-Shing Lau, Kuo Ching Tien, Ra-Min Tain | 2023-11-07 |
| 11764344 | Package structure and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Kai-Ming Yang | 2023-09-19 |
| 11715715 | Metal bump structure and manufacturing method thereof and driving substrate | Ming-Ru Chen, Cheng-Chung Lo, Chin-Sheng Wang, Wen-Sen Tang | 2023-08-01 |
| 11710690 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang, Chia-Yu Peng +1 more | 2023-07-25 |
| 11690180 | Manufacturing method of carrier structure | Cheng-Ta Ko, Pu-Ju Lin, Tse-Wei Wang | 2023-06-27 |
| 11690173 | Circuit board structure | Chin-Sheng Wang, Ra-Min Tain | 2023-06-27 |
| 11682612 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang, Chi-Hai Kuo +1 more | 2023-06-20 |
| 11665832 | Circuit board structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Kai-Ming Yang +2 more | 2023-05-30 |
| 11600936 | Circuit board structure | Pei-Wei Wang, Ching-Ho Hsieh, Shao-Chien Lee, Kuo-Wei Li | 2023-03-07 |
| 11579178 | Inspection apparatus for bare circuit board | Hsin-Hung Lee, Chun-Hsien Chien, Yu-Chung Hsieh, Yi-Hsiu Fang | 2023-02-14 |
| 11562972 | Manufacturing method of the chip package structure having at least one chip and at least one thermally conductive element | John Hon-Shing Lau, Yu-Chi Shen, Chen-Hua Cheng, Pei-Wei Wang | 2023-01-24 |
| 11540396 | Circuit board structure and manufacturing method thereof | Shao-Chien Lee, John Hon-Shing Lau, Chen-Hua Cheng, Ra-Min Tain | 2022-12-27 |
| 11516910 | Circuit board structure and manufacturing method thereof | Chia-Yu Peng, John Hon-Shing Lau, Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko | 2022-11-29 |
| 11445617 | Package structure and manufacturing method thereof | Kai-Ming Yang, Chen-Hao Lin, Cheng-Ta Ko, John Hon-Shing Lau, Yu-Hua Chen | 2022-09-13 |
| 11410971 | Chip package structure | Pu-Ju Lin, Cheng-Ta Ko, Ra-Min Tain | 2022-08-09 |
| 11410940 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Ra-Min Tain | 2022-08-09 |