Issued Patents All Time
Showing 26–50 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410940 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Ra-Min Tain | 2022-08-09 |
| 11362057 | Chip package structure and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Ra-Min Tain | 2022-06-14 |
| 11335670 | Light emitting diode package structure and manufacturing method thereof | Ming-Ru Chen, Cheng-Chung Lo | 2022-05-17 |
| 11145610 | Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereof | John Hon-Shing Lau, Yu-Chi Shen, Chen-Hua Cheng, Pei-Wei Wang | 2021-10-12 |
| 11127664 | Circuit board and manufacturing method thereof | Ra-Min Tain, Kai-Ming Yang, Wang-Hsiang Tsai | 2021-09-21 |
| 11114782 | Method of manufacturing circuit board structure | Pei-Wei Wang, Ching-Ho Hsieh, Shao-Chien Lee, Kuo-Wei Li | 2021-09-07 |
| 10957658 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Ra-Min Tain | 2021-03-23 |
| 10925172 | Carrier structure and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Tse-Wei Wang | 2021-02-16 |
| 10897823 | Circuit board, package structure and method of manufacturing the same | Cheng-Ta Ko, Kai-Ming Yang, Chih-Lun Wang | 2021-01-19 |
| 10863618 | Composite substrate structure and manufacturing method thereof | Pei-Wei Wang, Bo-Cheng Lin, Chun-Hsien Chien, Chien-Chou Chen | 2020-12-08 |
| 10854803 | Manufacturing method of light emitting device package structure with circuit redistribution structure | Pei-Wei Wang, Cheng-Ta Ko, Yu-Hua Chen, De-Shiang LIU | 2020-12-01 |
| 10756050 | Package structure and bonding method thereof | Cheng-Ta Ko, Kai-Ming Yang, Yu-Hua Chen | 2020-08-25 |
| 10685922 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Ra-Min Tain | 2020-06-16 |
| 10658282 | Package substrate structure and bonding method thereof | Cheng-Ta Ko, Kai-Ming Yang, Yu-Hua Chen | 2020-05-19 |
| 10651358 | Light emitting device package structure with circuit redistribution structure and manufacturing method thereof | Pei-Wei Wang, Cheng-Ta Ko, Yu-Hua Chen, De-Shiang LIU | 2020-05-12 |
| 10588214 | Stacked structure and method for manufacturing the same | Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen | 2020-03-10 |
| 10271433 | Method of fabricating an electrical device package structure | Shu-Sheng Chiang, Tsung-Yuan Chen, Shih-Lian Cheng | 2019-04-23 |
| 10211139 | Chip package structure | Yu-Hua Chen, Ra-Min Tain | 2019-02-19 |
| 10076039 | Method of fabricating packaging substrate | Chung W. Ho | 2018-09-11 |
| 9933149 | Illumination apparatus | Tzu-Shih Shen | 2018-04-03 |
| 9913418 | Process of an embedded component structure | Wei-Ming Cheng | 2018-03-06 |
| 9859130 | Manufacturing method of interposed substrate | Dyi-Chung Hu, Ming-Chih Chen | 2018-01-02 |
| 9831103 | Manufacturing method of interposed substrate | Dyi-Chung Hu, Ming-Chih Chen | 2017-11-28 |
| 9781843 | Method of fabricating packaging substrate having embedded through-via interposer | Dyi-Chung Hu | 2017-10-03 |
| 9510464 | Manufacturing method of circuit board | Shu-Sheng Chiang, Tsung-Yuan Chen | 2016-11-29 |