Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11562972 | Manufacturing method of the chip package structure having at least one chip and at least one thermally conductive element | John Hon-Shing Lau, Tzyy-Jang Tseng, Chen-Hua Cheng, Pei-Wei Wang | 2023-01-24 |
| 11145610 | Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereof | John Hon-Shing Lau, Tzyy-Jang Tseng, Chen-Hua Cheng, Pei-Wei Wang | 2021-10-12 |